Impact of OFF-State, HCI and BTI degradation in FDSOI Ω-gate NW-FETs

In this work, the degradation of N-type FDSOI Ω-gate NW-FETs caused by OFF-State stress under different conditions has been experimentally studied and compared with the effects of positive/negative BTI and HCI aging. The experimental observations show that, in these devices, HCI and OFF-State are th...

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Detalles Bibliográficos
Autores: Valdivieso, Carlos|||0000-0002-4259-931X, Crespo Yepes, Albert|||0000-0003-4618-651X, Miranda, R., Bernal, D., Martin Martinez, Javier|||0000-0001-5938-5898, Rodríguez Martínez, Rosana|||0000-0002-4565-6703, Nafria, Montserrat|||0000-0002-9549-2890
Tipo de recurso: artículo
Fecha de publicación:2023
País:España
Institución:Universitat Autònoma de Barcelona
Repositorio:Dipòsit Digital de Documents de la UAB
Idioma:inglés
OAI Identifier:oai:ddd.uab.cat:283399
Acceso en línea:https://ddd.uab.cat/record/283399
https://dx.doi.org/urn:doi:10.1016/j.sse.2023.108625
Access Level:acceso abierto
Palabra clave:Aging
BTI
FD-SOI
HCI
NW-FETs
OFF-State
Reliability
Stress
Descripción
Sumario:In this work, the degradation of N-type FDSOI Ω-gate NW-FETs caused by OFF-State stress under different conditions has been experimentally studied and compared with the effects of positive/negative BTI and HCI aging. The experimental observations show that, in these devices, HCI and OFF-State are the most damaging aging mechanisms while N/PBTI stresses produce negligible degradation. Moreover, for large enough stress conditions, OFF-State aging introduces large leakage currents, largely distorting the ID-VG curves of the transistor.