Injected charge to recovery as a parameter to characterize the breakdown reversibility of ultrathin HfSiON gate dielectric

The injected charge to recovery (QR) is presented as a parameter to characterize the dielectric breakdown (BD)reversibility in MOSFETs with ultrathin high-k hafnium based gate dielectric. The procedure to recover the dielectric is explained and the dependences of QR with the current limit during BD,...

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Detalles Bibliográficos
Autores: Crespo Yepes, Albert|||0000-0003-4618-651X, Martin Martinez, Javier|||0000-0001-5938-5898, Rothschild, A., Rodríguez Martínez, Rosana|||0000-0002-4565-6703, Nafria, Montserrat|||0000-0002-9549-2890, Aymerich Humet, Xavier|||0000-0002-5874-6257
Tipo de recurso: artículo
Fecha de publicación:2011
País:España
Institución:Universitat Autònoma de Barcelona
Repositorio:Dipòsit Digital de Documents de la UAB
Idioma:inglés
OAI Identifier:oai:ddd.uab.cat:138450
Acceso en línea:https://ddd.uab.cat/record/138450
https://dx.doi.org/urn:doi:10.1109/TDMR.2010.2098032
Access Level:acceso abierto
Palabra clave:Dielectric breakdown (BD)
BD reversibility
High-k
Reliability
Resistive switching
CMOS
Descripción
Sumario:The injected charge to recovery (QR) is presented as a parameter to characterize the dielectric breakdown (BD)reversibility in MOSFETs with ultrathin high-k hafnium based gate dielectric. The procedure to recover the dielectric is explained and the dependences of QR with the current limit during BD, the polarity of the BD-recovery stresses and the number of stress cycles are analyzed.