Electrical stress on irradiated thin gate oxide partially depleted SOI nMOSFETs

The effect of hot-carrier stress on 60 MeV proton irradiated thin gate oxide partially depleted SOI nMOSFETs has been studied. The results are compared with those from the electrical stress of non-irradiated devices. Whereas no significant differences are observed for the front channel degradation,...

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Detalles Bibliográficos
Autores: Rafí, Joan Marc, Simoen, E., Mercha, A., Hayama, K., Campabadal, Francesca, Ohyama, H., Claeys, C.
Tipo de recurso: artículo
Fecha de publicación:2007
País:España
Institución:Consejo Superior de Investigaciones Científicas (CSIC)
Repositorio:DIGITAL.CSIC. Repositorio Institucional del CSIC
OAI Identifier:oai:digital.csic.es:10261/256988
Acceso en línea:http://hdl.handle.net/10261/256988
https://api.elsevier.com/content/abstract/scopus_id/34248655935
Access Level:acceso abierto
Palabra clave:Hot-carrier degradation | MOSFETs | Partially-depleted SOI | Radiation-induced damage | Silicon on insulator
Descripción
Sumario:The effect of hot-carrier stress on 60 MeV proton irradiated thin gate oxide partially depleted SOI nMOSFETs has been studied. The results are compared with those from the electrical stress of non-irradiated devices. Whereas no significant differences are observed for the front channel degradation, hot-electron trapping in the buried oxide is found to be enhanced in the irradiated devices. This hot-electron trapping leads to a compensation or neutralization of the effects caused by the radiation-induced positive trapped charges. It is shown that a similar hot-electron trapping enhancement can be achieved in non-irradiated devices stressed under certain back gate bias conditions. © 2007 Elsevier B.V. All rights reserved.