Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices

In this paper a novel soldering technique that improves the fabrication process of Empty Substrate Integrated Waveguide (ESIW) devices is presented. Until now, in order to fabricate an ESIW device, the tin solder paste was distributed, before assembling, on the contact surface between layers, in ord...

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Detalles Bibliográficos
Autores: Martínez, Juan Ángel, Belenguer, Ángel, Esteban, Héctor
Tipo de recurso: artículo
Fecha de publicación:2019
País:España
Institución:Universidad de Castilla-La Mancha
Repositorio:RUIdeRA. Repositorio Institucional de la UCLM
OAI Identifier:oai:ruidera.uclm.es:10578/21918
Acceso en línea:http://hdl.handle.net/10578/21918
Access Level:acceso abierto
Palabra clave:Empty substrate integrated waveguide
ESIW
Multilayer
Fabrication
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spelling Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide DevicesMartínez, Juan ÁngelBelenguer, ÁngelEsteban, HéctorEmpty substrate integrated waveguideESIWMultilayerFabricationIn this paper a novel soldering technique that improves the fabrication process of Empty Substrate Integrated Waveguide (ESIW) devices is presented. Until now, in order to fabricate an ESIW device, the tin solder paste was distributed, before assembling, on the contact surface between layers, in order to ensure a good electrical contact. This process has a low degree of repeatability (random soldering thickness and distribution of tin) and reliability (significant number of non-working prototypes due to tin overflow). In this work, we propose the mechanization of a set of plated vias just next to the metallized walls of the ESIW in the central layer. Next, in the top and bottom covers that close this ESIW, additional plated vias are drilled in the same position, so that, when the device is assembled (using screws or rivets), metallized holes can be seen passing through the whole structure from top to bottom. These holes are then used as soldering vias that can guide the tin paste straight to the point where it is needed. When the paste is dried, soldered vias ensure a very good electrical contact between layers. Besides, the fluid tin fills any small gap that appears between layers, thus providing a very good electrical contact and mechanical union. This novel soldering technique has been validated with experimental results. Several prototypes of filters centered at 13 and 35 GHz have been fabricated, proving the repeatability and reliability of the proposed soldering technique.EEUU: Institute of Electrical and Electronics Engineers, IEEE201920192019info:eu-repo/semantics/articleapplication/pdfapplication/pdfhttp://hdl.handle.net/10578/21918reponame:RUIdeRA. Repositorio Institucional de la UCLMinstname:Universidad de Castilla-La ManchaInglésinfo:eu-repo/semantics/openAccessoai:ruidera.uclm.es:10578/219182026-05-27T07:36:41Z
dc.title.none.fl_str_mv Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
title Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
spellingShingle Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
Martínez, Juan Ángel
Empty substrate integrated waveguide
ESIW
Multilayer
Fabrication
title_short Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
title_full Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
title_fullStr Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
title_full_unstemmed Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
title_sort Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
dc.creator.none.fl_str_mv Martínez, Juan Ángel
Belenguer, Ángel
Esteban, Héctor
author Martínez, Juan Ángel
author_facet Martínez, Juan Ángel
Belenguer, Ángel
Esteban, Héctor
author_role author
author2 Belenguer, Ángel
Esteban, Héctor
author2_role author
author
dc.subject.none.fl_str_mv Empty substrate integrated waveguide
ESIW
Multilayer
Fabrication
topic Empty substrate integrated waveguide
ESIW
Multilayer
Fabrication
description In this paper a novel soldering technique that improves the fabrication process of Empty Substrate Integrated Waveguide (ESIW) devices is presented. Until now, in order to fabricate an ESIW device, the tin solder paste was distributed, before assembling, on the contact surface between layers, in order to ensure a good electrical contact. This process has a low degree of repeatability (random soldering thickness and distribution of tin) and reliability (significant number of non-working prototypes due to tin overflow). In this work, we propose the mechanization of a set of plated vias just next to the metallized walls of the ESIW in the central layer. Next, in the top and bottom covers that close this ESIW, additional plated vias are drilled in the same position, so that, when the device is assembled (using screws or rivets), metallized holes can be seen passing through the whole structure from top to bottom. These holes are then used as soldering vias that can guide the tin paste straight to the point where it is needed. When the paste is dried, soldered vias ensure a very good electrical contact between layers. Besides, the fluid tin fills any small gap that appears between layers, thus providing a very good electrical contact and mechanical union. This novel soldering technique has been validated with experimental results. Several prototypes of filters centered at 13 and 35 GHz have been fabricated, proving the repeatability and reliability of the proposed soldering technique.
publishDate 2019
dc.date.none.fl_str_mv 2019
2019
2019
dc.type.none.fl_str_mv info:eu-repo/semantics/article
format article
dc.identifier.none.fl_str_mv http://hdl.handle.net/10578/21918
url http://hdl.handle.net/10578/21918
dc.language.none.fl_str_mv Inglés
language_invalid_str_mv Inglés
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
application/pdf
dc.publisher.none.fl_str_mv EEUU: Institute of Electrical and Electronics Engineers, IEEE
publisher.none.fl_str_mv EEUU: Institute of Electrical and Electronics Engineers, IEEE
dc.source.none.fl_str_mv reponame:RUIdeRA. Repositorio Institucional de la UCLM
instname:Universidad de Castilla-La Mancha
instname_str Universidad de Castilla-La Mancha
reponame_str RUIdeRA. Repositorio Institucional de la UCLM
collection RUIdeRA. Repositorio Institucional de la UCLM
repository.name.fl_str_mv
repository.mail.fl_str_mv
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score 15.300724

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