Cita APA

Martínez, J. Á., Belenguer, Á., & Esteban, H. (2019). Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices.

Citación estilo Chicago

Martínez, Juan Ángel, Ángel Belenguer, y Héctor Esteban. Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices. 2019.

Cita MLA

Martínez, Juan Ángel, Ángel Belenguer, y Héctor Esteban. Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices. 2019.