BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits

© 2021 by the authors.

Detalhes bibliográficos
Autores: Altet, Josep, Barajas, Enrique, Mateo, Diego, Billong, Alexandre, Aragonés, Xavier, Perpiñà, X., Reverter, Ferran
Formato: artículo
Estado:Versión publicada
Fecha de publicación:2021
País:España
Recursos:Consejo Superior de Investigaciones Científicas (CSIC)
Repositorio:DIGITAL.CSIC. Repositorio Institucional del CSIC
OAI Identifier:oai:digital.csic.es:10261/227957
Acesso em linha:http://hdl.handle.net/10261/227957
Access Level:acceso abierto
Palavra-chave:CMOS thermal sensor
CMOS built-in sensor
CMOS integrated circuits
Measurement of RF CMOS circuits
Built-in test and measurement
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spelling BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF CircuitsAltet, JosepBarajas, EnriqueMateo, DiegoBillong, AlexandreAragonés, XavierPerpiñà, X.Reverter, FerranCMOS thermal sensorCMOS built-in sensorCMOS integrated circuitsMeasurement of RF CMOS circuitsBuilt-in test and measurement© 2021 by the authors.A new sensor topology meant to extract figures of merit of radio-frequency analog integrated circuits (RF-ICs) was experimentally validated. Implemented in a standard 0.35 μm complementary metal-oxide-semiconductor (CMOS) technology, it comprised two blocks: a single metal-oxide-semiconductor (MOS) transistor acting as temperature transducer, which was placed near the circuit to monitor, and an active band-pass filter amplifier. For validation purposes, the temperature sensor was integrated with a tuned radio-frequency power amplifier (420 MHz) and MOS transistors acting as controllable dissipating devices. First, using the MOS dissipating devices, the performance and limitations of the different blocks that constitute the temperature sensor were characterized. Second, by using the heterodyne technique (applying two nearby tones) to the power amplifier (PA) and connecting the sensor output voltage to a low-cost AC voltmeter, the PA’s output power and its central frequency were monitored. As a result, this topology resulted in a low-cost approach, with high linearity and sensitivity, for RF-IC testing and variability monitoring.This research was funded by Spanish AEI–Agencia Estatal de Investigación–grant number PID2019-103869RB-C33. (X.P.) has also received founds from the Spanish Ministry of Science, Innovation and Universities through Agencia Estatal de Investigación (AEI) (projects: HIPERCELLS, RTI2018-098392B-I00, and “Fiabilidad Inteligente”, PCI2020-112028).Peer reviewedMultidisciplinary Digital Publishing InstituteMinisterio de Ciencia, Innovación y Universidades (España)Agencia Estatal de Investigación (España)Consejo Superior de Investigaciones Científicas [https://ror.org/02gfc7t72]2021202120212021info:eu-repo/semantics/articlehttp://purl.org/coar/resource_type/c_6501Publisher's versioninfo:eu-repo/semantics/publishedVersionhttp://hdl.handle.net/10261/227957reponame:DIGITAL.CSIC. Repositorio Institucional del CSICinstname:Consejo Superior de Investigaciones Científicas (CSIC)Inglés#PLACEHOLDER_PARENT_METADATA_VALUE##PLACEHOLDER_PARENT_METADATA_VALUE##PLACEHOLDER_PARENT_METADATA_VALUE##PLACEHOLDER_PARENT_METADATA_VALUE##PLACEHOLDER_PARENT_METADATA_VALUE##PLACEHOLDER_PARENT_METADATA_VALUE#info:eu-repo/grantAgreement/AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020/PID2019-103869RB-C33PID2019-103869RB-C33/AEI/10.13039/501100011033info:eu-repo/grantAgreement/AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020/RTI2018-098392B-I00RTI2018-098392B-I00/AEI/10.13039/501100011033info:eu-repo/grantAgreement/AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020/PCI2020-112028PCI2020-112028/AEI/10.13039/501100011033https://doi.org/10.3390/s21030805Síinfo:eu-repo/semantics/openAccessoai:digital.csic.es:10261/2279572026-05-22T06:33:51Z
dc.title.none.fl_str_mv BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits
title BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits
spellingShingle BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits
Altet, Josep
CMOS thermal sensor
CMOS built-in sensor
CMOS integrated circuits
Measurement of RF CMOS circuits
Built-in test and measurement
title_short BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits
title_full BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits
title_fullStr BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits
title_full_unstemmed BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits
title_sort BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits
dc.creator.none.fl_str_mv Altet, Josep
Barajas, Enrique
Mateo, Diego
Billong, Alexandre
Aragonés, Xavier
Perpiñà, X.
Reverter, Ferran
author Altet, Josep
author_facet Altet, Josep
Barajas, Enrique
Mateo, Diego
Billong, Alexandre
Aragonés, Xavier
Perpiñà, X.
Reverter, Ferran
author_role author
author2 Barajas, Enrique
Mateo, Diego
Billong, Alexandre
Aragonés, Xavier
Perpiñà, X.
Reverter, Ferran
author2_role author
author
author
author
author
author
dc.contributor.none.fl_str_mv Ministerio de Ciencia, Innovación y Universidades (España)
Agencia Estatal de Investigación (España)
Consejo Superior de Investigaciones Científicas [https://ror.org/02gfc7t72]
dc.subject.none.fl_str_mv CMOS thermal sensor
CMOS built-in sensor
CMOS integrated circuits
Measurement of RF CMOS circuits
Built-in test and measurement
topic CMOS thermal sensor
CMOS built-in sensor
CMOS integrated circuits
Measurement of RF CMOS circuits
Built-in test and measurement
description © 2021 by the authors.
publishDate 2021
dc.date.none.fl_str_mv 2021
2021
2021
2021
dc.type.none.fl_str_mv info:eu-repo/semantics/article
http://purl.org/coar/resource_type/c_6501
Publisher's version
info:eu-repo/semantics/publishedVersion
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://hdl.handle.net/10261/227957
url http://hdl.handle.net/10261/227957
dc.language.none.fl_str_mv Inglés
language_invalid_str_mv Inglés
dc.relation.none.fl_str_mv #PLACEHOLDER_PARENT_METADATA_VALUE#
#PLACEHOLDER_PARENT_METADATA_VALUE#
#PLACEHOLDER_PARENT_METADATA_VALUE#
#PLACEHOLDER_PARENT_METADATA_VALUE#
#PLACEHOLDER_PARENT_METADATA_VALUE#
#PLACEHOLDER_PARENT_METADATA_VALUE#
info:eu-repo/grantAgreement/AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020/PID2019-103869RB-C33
PID2019-103869RB-C33/AEI/10.13039/501100011033
info:eu-repo/grantAgreement/AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020/RTI2018-098392B-I00
RTI2018-098392B-I00/AEI/10.13039/501100011033
info:eu-repo/grantAgreement/AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020/PCI2020-112028
PCI2020-112028/AEI/10.13039/501100011033
https://doi.org/10.3390/s21030805
Sí
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.publisher.none.fl_str_mv Multidisciplinary Digital Publishing Institute
publisher.none.fl_str_mv Multidisciplinary Digital Publishing Institute
dc.source.none.fl_str_mv reponame:DIGITAL.CSIC. Repositorio Institucional del CSIC
instname:Consejo Superior de Investigaciones Científicas (CSIC)
instname_str Consejo Superior de Investigaciones Científicas (CSIC)
reponame_str DIGITAL.CSIC. Repositorio Institucional del CSIC
collection DIGITAL.CSIC. Repositorio Institucional del CSIC
repository.name.fl_str_mv
repository.mail.fl_str_mv
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score 15,811543

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