Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices

[EN] In this paper, a novel mymargin soldering technique that improves the fabrication process of empty substrate integrated waveguide (ESIW) devices is presented. Up until now, in order to fabricate an ESIW device, the tin solder paste was distributed, before assembling, on the contact surface betw...

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Detalles Bibliográficos
Autores: Martinez, Juan A., Belenguer, Angel, Esteban González, Héctor|||0000-0002-5936-658X
Tipo de recurso: artículo
Fecha de publicación:2019
País:España
Institución:Universitat Politècnica de València (UPV)
Repositorio:RiuNet. Repositorio Institucional de la Universitat Politécnica de Valéncia
Idioma:inglés
OAI Identifier:oai:riunet.upv.es:10251/157288
Acceso en línea:https://riunet.upv.es/handle/10251/157288
Access Level:acceso abierto
Palabra clave:Soldering
Tin
Prototypes
Reliability
Substrates
Contacts
Electromagnetic waveguides
Empty substrate integrated waveguide (ESIW)
Fabrication
Multilayer
TEORIA DE LA SEÑAL Y COMUNICACIONES
09.- Desarrollar infraestructuras resilientes, promover la industrialización inclusiva y sostenible, y fomentar la innovación
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repository_id_str
spelling Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide DevicesMartinez, Juan A.Belenguer, AngelEsteban González, Héctor|||0000-0002-5936-658XSolderingTinPrototypesReliabilitySubstratesContactsElectromagnetic waveguidesEmpty substrate integrated waveguide (ESIW)FabricationMultilayerTEORIA DE LA SEÑAL Y COMUNICACIONES09.- Desarrollar infraestructuras resilientes, promover la industrialización inclusiva y sostenible, y fomentar la innovación[EN] In this paper, a novel mymargin soldering technique that improves the fabrication process of empty substrate integrated waveguide (ESIW) devices is presented. Up until now, in order to fabricate an ESIW device, the tin solder paste was distributed, before assembling, on the contact surface between layers, in order to ensure a good electrical contact. This process has a low degree of repeatability (random soldering thickness and distribution of tin) and reliability (a significant number of nonworking prototypes due to tin overflow). In this paper, we propose the mechanization of a set of plated vias just next to the metalized walls of the ESIW in the central layer. Next, in the top and bottom covers that close this ESIW, additional plated vias are drilled in the same position so that, when the device is assembled (using screws or rivets), metalized holes can be seen passing through the whole structure from top to bottom. These holes are then used as soldering vias that can guide the tin paste straight to the point where it is needed. When the paste is dried, soldered vias ensure a very good electrical contact between layers. In addition, the fluid tin fills any small gap that appears between layers, thus providing a very good electrical contact and mechanical union. This novel soldering technique has been validated with experimental results. Several prototypes of filters centered at 13 and 35 GHz have been fabricated, proving the repeatability and reliability of the proposed soldering technique.This work was supported by the Ministerio de Economiy Competitividad, Spanish Government, under Project TEC2016-75934-C4-3-R and Project TEC2016-75934-C4-1-R.Institute of Electrical and Electronics EngineersEscuela Técnica Superior de Ingeniería de TelecomunicaciónDepartamento de ComunicacionesInstituto Universitario de Telecomunicación y Aplicaciones MultimediaMinisterio de Economía y CompetitividadRepositorio Institucional de la Universitat Politècnica de València Riunet20192019-11-01journal articlehttp://purl.org/coar/resource_type/c_6501VoRhttp://purl.org/coar/version/c_970fb48d4fbd8a85info:eu-repo/semantics/articleapplication/pdfapplication/pdfhttps://riunet.upv.es/handle/10251/157288reponame:RiuNet. Repositorio Institucional de la Universitat Politécnica de Valénciainstname:Universitat Politècnica de València (UPV)InglésengMinisterio de Economía y Competitividad http://dx.doi.org/10.13039/501100003329 TEC2016-75934-C4-3-R DEMOSTRADORES TECNOLOGICOS BASADOS EN GUIAS VACIAS INTEGRADAS EN SUSTRATO PARA APLICACIONES ESPACIALES EMERGENTESMinisterio de Economía y Competitividad http://dx.doi.org/10.13039/501100003329 TEC2016-75934-C4-1-R DEMOSTRADORES TECNOLOGICOS DE FILTROS Y MULTIPLEXORES CON RESPUESTAS SELECTIVAS Y SINTONIZABLES EN NUEVAS GUIAS COMPACTAS PARA APLICACIONES ESPACIALESopen accesshttp://purl.org/coar/access_right/c_abf2Reserva de todos los derechoshttp://rightsstatements.org/vocab/InC/1.0/info:eu-repo/semantics/openAccessoai:riunet.upv.es:10251/1572882026-06-13T07:49:27Z
dc.title.none.fl_str_mv Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
title Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
spellingShingle Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
Martinez, Juan A.
Soldering
Tin
Prototypes
Reliability
Substrates
Contacts
Electromagnetic waveguides
Empty substrate integrated waveguide (ESIW)
Fabrication
Multilayer
TEORIA DE LA SEÑAL Y COMUNICACIONES
09.- Desarrollar infraestructuras resilientes, promover la industrialización inclusiva y sostenible, y fomentar la innovación
title_short Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
title_full Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
title_fullStr Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
title_full_unstemmed Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
title_sort Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
dc.creator.none.fl_str_mv Martinez, Juan A.
Belenguer, Angel
Esteban González, Héctor|||0000-0002-5936-658X
author Martinez, Juan A.
author_facet Martinez, Juan A.
Belenguer, Angel
Esteban González, Héctor|||0000-0002-5936-658X
author_role author
author2 Belenguer, Angel
Esteban González, Héctor|||0000-0002-5936-658X
author2_role author
author
dc.contributor.none.fl_str_mv Escuela Técnica Superior de Ingeniería de Telecomunicación
Departamento de Comunicaciones
Instituto Universitario de Telecomunicación y Aplicaciones Multimedia
Ministerio de Economía y Competitividad
Repositorio Institucional de la Universitat Politècnica de València Riunet
dc.subject.none.fl_str_mv Soldering
Tin
Prototypes
Reliability
Substrates
Contacts
Electromagnetic waveguides
Empty substrate integrated waveguide (ESIW)
Fabrication
Multilayer
TEORIA DE LA SEÑAL Y COMUNICACIONES
09.- Desarrollar infraestructuras resilientes, promover la industrialización inclusiva y sostenible, y fomentar la innovación
topic Soldering
Tin
Prototypes
Reliability
Substrates
Contacts
Electromagnetic waveguides
Empty substrate integrated waveguide (ESIW)
Fabrication
Multilayer
TEORIA DE LA SEÑAL Y COMUNICACIONES
09.- Desarrollar infraestructuras resilientes, promover la industrialización inclusiva y sostenible, y fomentar la innovación
description [EN] In this paper, a novel mymargin soldering technique that improves the fabrication process of empty substrate integrated waveguide (ESIW) devices is presented. Up until now, in order to fabricate an ESIW device, the tin solder paste was distributed, before assembling, on the contact surface between layers, in order to ensure a good electrical contact. This process has a low degree of repeatability (random soldering thickness and distribution of tin) and reliability (a significant number of nonworking prototypes due to tin overflow). In this paper, we propose the mechanization of a set of plated vias just next to the metalized walls of the ESIW in the central layer. Next, in the top and bottom covers that close this ESIW, additional plated vias are drilled in the same position so that, when the device is assembled (using screws or rivets), metalized holes can be seen passing through the whole structure from top to bottom. These holes are then used as soldering vias that can guide the tin paste straight to the point where it is needed. When the paste is dried, soldered vias ensure a very good electrical contact between layers. In addition, the fluid tin fills any small gap that appears between layers, thus providing a very good electrical contact and mechanical union. This novel soldering technique has been validated with experimental results. Several prototypes of filters centered at 13 and 35 GHz have been fabricated, proving the repeatability and reliability of the proposed soldering technique.
publishDate 2019
dc.date.none.fl_str_mv 2019
2019-11-01
dc.type.none.fl_str_mv journal article
http://purl.org/coar/resource_type/c_6501
VoR
http://purl.org/coar/version/c_970fb48d4fbd8a85
dc.type.openaire.fl_str_mv info:eu-repo/semantics/article
format article
dc.identifier.none.fl_str_mv https://riunet.upv.es/handle/10251/157288
url https://riunet.upv.es/handle/10251/157288
dc.language.none.fl_str_mv Inglés
eng
language_invalid_str_mv Inglés
language eng
dc.relation.none.fl_str_mv Ministerio de Economía y Competitividad http://dx.doi.org/10.13039/501100003329 TEC2016-75934-C4-3-R DEMOSTRADORES TECNOLOGICOS BASADOS EN GUIAS VACIAS INTEGRADAS EN SUSTRATO PARA APLICACIONES ESPACIALES EMERGENTES
Ministerio de Economía y Competitividad http://dx.doi.org/10.13039/501100003329 TEC2016-75934-C4-1-R DEMOSTRADORES TECNOLOGICOS DE FILTROS Y MULTIPLEXORES CON RESPUESTAS SELECTIVAS Y SINTONIZABLES EN NUEVAS GUIAS COMPACTAS PARA APLICACIONES ESPACIALES
dc.rights.none.fl_str_mv open access
http://purl.org/coar/access_right/c_abf2
Reserva de todos los derechos
http://rightsstatements.org/vocab/InC/1.0/
dc.rights.openaire.fl_str_mv info:eu-repo/semantics/openAccess
rights_invalid_str_mv open access
http://purl.org/coar/access_right/c_abf2
Reserva de todos los derechos
http://rightsstatements.org/vocab/InC/1.0/
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
application/pdf
dc.publisher.none.fl_str_mv Institute of Electrical and Electronics Engineers
publisher.none.fl_str_mv Institute of Electrical and Electronics Engineers
dc.source.none.fl_str_mv reponame:RiuNet. Repositorio Institucional de la Universitat Politécnica de Valéncia
instname:Universitat Politècnica de València (UPV)
instname_str Universitat Politècnica de València (UPV)
reponame_str RiuNet. Repositorio Institucional de la Universitat Politécnica de Valéncia
collection RiuNet. Repositorio Institucional de la Universitat Politécnica de Valéncia
repository.name.fl_str_mv
repository.mail.fl_str_mv
_version_ 1869411596352094208
score 15.300724

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