A model for IR-drop in PDNs of 3D ICs with two tiers. Draft
This paper is an extension of a previous published paper from the author. The methods and assumptions to find analytical expressions of IR-drop in 3D PDNs are essentially the same and can be summarized as follows: power and ground PDNs can be considered as conducting planes with given constant sheet...
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| Formato: | informe técnico |
| Fecha de publicación: | 2014 |
| País: | España |
| Recursos: | Universitat Politècnica de Catalunya (UPC) |
| Repositorio: | UPCommons. Portal del coneixement obert de la UPC |
| Idioma: | inglés |
| OAI Identifier: | oai:upcommons.upc.edu:2117/442004 |
| Acesso em linha: | https://hdl.handle.net/2117/442004 |
| Access Level: | acceso abierto |
| Palavra-chave: | IR-drop Power delivery network (PDN ) 3D PDN Àrees temàtiques de la UPC::Enginyeria electrònica Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica::Circuits integrats |
| Resumo: | This paper is an extension of a previous published paper from the author. The methods and assumptions to find analytical expressions of IR-drop in 3D PDNs are essentially the same and can be summarized as follows: power and ground PDNs can be considered as conducting planes with given constant sheet resistance RS; the whole digital circuit can be divided in rectangular portions (blocks) of given dimensions and having constant current density J [A/m2]; power and ground pads are distributed at arbitrary places on top of the top tier. |
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