Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints
[EN] Efficient thermal management in microelectronic assemblies is crucial for the optimal performance and reliability of microprocessors. This study investigates the thermal, static, and creep performance of pressure-sensitive adhesives (PSAs) used in bonding heatsinks to microchips, focusing on th...
| Autores: | , , , , |
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| Formato: | artículo |
| Estado: | Versión publicada |
| Fecha de publicación: | 2024 |
| País: | España |
| Recursos: | Universidad de León |
| Repositorio: | BULERIA. Repositorio Institucional de la Universidad de León |
| OAI Identifier: | oai:buleria.unileon.es:10612/23546 |
| Acesso em linha: | https://hdl.handle.net/10612/23546 |
| Access Level: | acceso abierto |
| Palavra-chave: | Ingeniería de minas thermal microelectronic pressure-sensitive adhesives 2205.02 Mecánica de Medios Continuos |
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Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive jointsGutiérrez Posada, VíctorAkhavan-Safar, A.Carbas, R. J. C.Marques, E. A. S.da Silva, L. F. MIngeniería de minasthermalmicroelectronicpressure-sensitive adhesives2205.02 Mecánica de Medios Continuos[EN] Efficient thermal management in microelectronic assemblies is crucial for the optimal performance and reliability of microprocessors. This study investigates the thermal, static, and creep performance of pressure-sensitive adhesives (PSAs) used in bonding heatsinks to microchips, focusing on the impact of adhesive coverage on thermal conductivity, mechanical strength, and long-term deformation under sustained loads. Shear loading, specifically analyzed due to the prevalence of shear stresses in vertically oriented microelectronic assemblies, is critical for understanding the long-term reliability of these bonds. The thermal analysis revealed that perfectly bonded heatsinks enhanced heat dissipation, with only a minor reduction in thermal conductivity observed due to incomplete adhesive coverage. Static tests demonstrated that perfectly bonded samples exhibited better load-bearing capacity overall, although joints with defects showed higher calculated stress due to the reduced bonded area at failure, with a 21% reduction in load-bearing capacity at room temperature and a 3.5% reduction at high temperature for joints with adhesive loss. Creep tests showed that at room temperature, the time to failure decreased by approximately 150% for samples with adhesive defects, while at high temperature, the reduction was over 66%. The study found that creep life is more sensitive to defects at lower temperatures, where adhesive loss has a more pronounced impact on performance. A predictive surface model was developed to estimate time to failure based on creep stress and temperature. Similar content being vieSIPublicación en abierto financiada por el Consorcio de Bibliotecas Universitarias de Castilla y León (BUCLE), con cargo al Programa Operativo 2014ES16RFOP009 FEDER 2014-2020 DE CASTILLA Y LEÓN, Actuación:20007-CL - Apoyo Consorcio BUCLESpringerMecanica de los Medios Continuos y Teoria de EstructurasEscuela Superior y Tecnica de Ingenieros de Minas2024info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttps://hdl.handle.net/10612/23546reponame:BULERIA. Repositorio Institucional de la Universidad de Leóninstname:Universidad de LeónIngléshttp://creativecommons.org/licenses/by-nc-nd/4.0/info:eu-repo/semantics/openAccessoai:buleria.unileon.es:10612/235462026-06-24T12:43:27Z |
| dc.title.none.fl_str_mv |
Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints |
| title |
Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints |
| spellingShingle |
Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints Gutiérrez Posada, Víctor Ingeniería de minas thermal microelectronic pressure-sensitive adhesives 2205.02 Mecánica de Medios Continuos |
| title_short |
Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints |
| title_full |
Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints |
| title_fullStr |
Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints |
| title_full_unstemmed |
Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints |
| title_sort |
Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints |
| dc.creator.none.fl_str_mv |
Gutiérrez Posada, Víctor Akhavan-Safar, A. Carbas, R. J. C. Marques, E. A. S. da Silva, L. F. M |
| author |
Gutiérrez Posada, Víctor |
| author_facet |
Gutiérrez Posada, Víctor Akhavan-Safar, A. Carbas, R. J. C. Marques, E. A. S. da Silva, L. F. M |
| author_role |
author |
| author2 |
Akhavan-Safar, A. Carbas, R. J. C. Marques, E. A. S. da Silva, L. F. M |
| author2_role |
author author author author |
| dc.contributor.none.fl_str_mv |
Mecanica de los Medios Continuos y Teoria de Estructuras Escuela Superior y Tecnica de Ingenieros de Minas |
| dc.subject.none.fl_str_mv |
Ingeniería de minas thermal microelectronic pressure-sensitive adhesives 2205.02 Mecánica de Medios Continuos |
| topic |
Ingeniería de minas thermal microelectronic pressure-sensitive adhesives 2205.02 Mecánica de Medios Continuos |
| description |
[EN] Efficient thermal management in microelectronic assemblies is crucial for the optimal performance and reliability of microprocessors. This study investigates the thermal, static, and creep performance of pressure-sensitive adhesives (PSAs) used in bonding heatsinks to microchips, focusing on the impact of adhesive coverage on thermal conductivity, mechanical strength, and long-term deformation under sustained loads. Shear loading, specifically analyzed due to the prevalence of shear stresses in vertically oriented microelectronic assemblies, is critical for understanding the long-term reliability of these bonds. The thermal analysis revealed that perfectly bonded heatsinks enhanced heat dissipation, with only a minor reduction in thermal conductivity observed due to incomplete adhesive coverage. Static tests demonstrated that perfectly bonded samples exhibited better load-bearing capacity overall, although joints with defects showed higher calculated stress due to the reduced bonded area at failure, with a 21% reduction in load-bearing capacity at room temperature and a 3.5% reduction at high temperature for joints with adhesive loss. Creep tests showed that at room temperature, the time to failure decreased by approximately 150% for samples with adhesive defects, while at high temperature, the reduction was over 66%. The study found that creep life is more sensitive to defects at lower temperatures, where adhesive loss has a more pronounced impact on performance. A predictive surface model was developed to estimate time to failure based on creep stress and temperature. Similar content being vie |
| publishDate |
2024 |
| dc.date.none.fl_str_mv |
2024 |
| dc.type.none.fl_str_mv |
info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion |
| format |
article |
| status_str |
publishedVersion |
| dc.identifier.none.fl_str_mv |
https://hdl.handle.net/10612/23546 |
| url |
https://hdl.handle.net/10612/23546 |
| dc.language.none.fl_str_mv |
Inglés |
| language_invalid_str_mv |
Inglés |
| dc.rights.none.fl_str_mv |
http://creativecommons.org/licenses/by-nc-nd/4.0/ info:eu-repo/semantics/openAccess |
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http://creativecommons.org/licenses/by-nc-nd/4.0/ |
| eu_rights_str_mv |
openAccess |
| dc.publisher.none.fl_str_mv |
Springer |
| publisher.none.fl_str_mv |
Springer |
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reponame:BULERIA. Repositorio Institucional de la Universidad de León instname:Universidad de León |
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Universidad de León |
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BULERIA. Repositorio Institucional de la Universidad de León |
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BULERIA. Repositorio Institucional de la Universidad de León |
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15,812455 |