Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints
[EN] Efficient thermal management in microelectronic assemblies is crucial for the optimal performance and reliability of microprocessors. This study investigates the thermal, static, and creep performance of pressure-sensitive adhesives (PSAs) used in bonding heatsinks to microchips, focusing on th...
| Autores: | , , , , |
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| Tipo de recurso: | artículo |
| Estado: | Versión publicada |
| Fecha de publicación: | 2024 |
| País: | España |
| Institución: | Universidad de León |
| Repositorio: | BULERIA. Repositorio Institucional de la Universidad de León |
| OAI Identifier: | oai:buleria.unileon.es:10612/23546 |
| Acceso en línea: | https://hdl.handle.net/10612/23546 |
| Access Level: | acceso abierto |
| Palabra clave: | Ingeniería de minas thermal microelectronic pressure-sensitive adhesives 2205.02 Mecánica de Medios Continuos |
| Sumario: | [EN] Efficient thermal management in microelectronic assemblies is crucial for the optimal performance and reliability of microprocessors. This study investigates the thermal, static, and creep performance of pressure-sensitive adhesives (PSAs) used in bonding heatsinks to microchips, focusing on the impact of adhesive coverage on thermal conductivity, mechanical strength, and long-term deformation under sustained loads. Shear loading, specifically analyzed due to the prevalence of shear stresses in vertically oriented microelectronic assemblies, is critical for understanding the long-term reliability of these bonds. The thermal analysis revealed that perfectly bonded heatsinks enhanced heat dissipation, with only a minor reduction in thermal conductivity observed due to incomplete adhesive coverage. Static tests demonstrated that perfectly bonded samples exhibited better load-bearing capacity overall, although joints with defects showed higher calculated stress due to the reduced bonded area at failure, with a 21% reduction in load-bearing capacity at room temperature and a 3.5% reduction at high temperature for joints with adhesive loss. Creep tests showed that at room temperature, the time to failure decreased by approximately 150% for samples with adhesive defects, while at high temperature, the reduction was over 66%. The study found that creep life is more sensitive to defects at lower temperatures, where adhesive loss has a more pronounced impact on performance. A predictive surface model was developed to estimate time to failure based on creep stress and temperature. Similar content being vie |
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