Cita APA

Gutiérrez Posada, V., Akhavan-Safar, A., Carbas, R. J. C., Marques, E. A. S., & da Silva, L. F. M. (2024). Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints.

Citación estilo Chicago

Gutiérrez Posada, Víctor, A. Akhavan-Safar, R. J. C. Carbas, E. A. S. Marques, y L. F. M. da Silva. Effect of Bonding Defects On Heat Transfer and Creep Response of Microprocessor-heatsink Adhesive Joints. 2024.

Cita MLA

Gutiérrez Posada, Víctor, et al. Effect of Bonding Defects On Heat Transfer and Creep Response of Microprocessor-heatsink Adhesive Joints. 2024.