P-doped polycrystalline silicon films obtained at low temperature by hot-wire chemical vapor deposition

P-doped polycrystalline silicon films were deposited over Corning 7059 substrates at a moderate temperature, 330°C, in a hot-wire reactor. The films were obtained from the decomposition of silane and hydrogen (10% SiH 4, 90% H 2) and different amounts of diborane. The structure and morphology of the...

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Detalles Bibliográficos
Autores: Puigdollers i González, Joaquim, Cifre, J., Polo Trasancos, Ma. del Carmen, Bertomeu i Balagueró, Joan, Andreu i Batallé, Jordi, Lloret, A.
Tipo de recurso: artículo
Estado:Versión aceptada para publicación
Fecha de publicación:1995
País:España
Institución:Varias* (Consorci de Biblioteques Universitáries de Catalunya, Centre de Serveis Científics i Acadèmics de Catalunya)
Repositorio:Recercat. Dipósit de la Recerca de Catalunya
OAI Identifier:oai:recercat.cat:2445/98758
Acceso en línea:https://hdl.handle.net/2445/98758
Access Level:acceso abierto
Palabra clave:Deposició química en fase vapor
Pel·lícules fines
Silici
Chemical vapor deposition
Thin films
Silicon
Descripción
Sumario:P-doped polycrystalline silicon films were deposited over Corning 7059 substrates at a moderate temperature, 330°C, in a hot-wire reactor. The films were obtained from the decomposition of silane and hydrogen (10% SiH 4, 90% H 2) and different amounts of diborane. The structure and morphology of the samples were studied with X-ray diffraction (XRD), Raman spectroscopy and scanning electron microscopy (SEM). X-ray diffraction spectra show sharp diffraction peaks corresponding to silicon reflections, and Raman spectra show no evidence of amorphous phases and present a high intensity and narrow peak at 520 cm -1, which is the typical feature of crystalline silicon structure. The efficiency of boron incorporation was studied by secondary ion mass spectrometry (SIMS). The electrical properties of doped samples were also studied.