Using temperature measurements to enhance security in front of hardware trojans

The goal of this document is to present a review of the work performed to carry out the task 3.5 of the Spanish National Project PID2019-103869RB-C33, entitled “El Reto de la Variabilidad en NANO-CMOS y BEYOND-CMOS: Nuevos Paradigmas de Diseño de Circuitos Integrados Para su Mitigación y Explotación...

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Bibliographic Details
Authors: Altet Sanahujes, Josep|||0000-0002-6939-6475, Mateo Peña, Diego|||0000-0001-5996-9092, Barajas Ojeda, Enrique|||0000-0002-2072-2268, Aragonès Cervera, Xavier|||0000-0003-1352-8675
Format: report
Publication Date:2023
Country:España
Institution:Universitat Politècnica de Catalunya (UPC)
Repository:UPCommons. Portal del coneixement obert de la UPC
Language:English
OAI Identifier:oai:upcommons.upc.edu:2117/391985
Online Access:https://hdl.handle.net/2117/391985
Access Level:Open access
Keyword:Integrated circuits
Detectors
Integrated Circuits
Differential temperature measurements
Integrated temperature sensors
Heterodyne temperature measurements
Hardware trojans
CMOS circuits
Circuits integrats
Àrees temàtiques de la UPC::Enginyeria electrònica::Circuits electrònics
Àrees temàtiques de la UPC::Enginyeria electrònica::Instrumentació i mesura::Sensors i actuadors
Description
Summary:The goal of this document is to present a review of the work performed to carry out the task 3.5 of the Spanish National Project PID2019-103869RB-C33, entitled “El Reto de la Variabilidad en NANO-CMOS y BEYOND-CMOS: Nuevos Paradigmas de Diseño de Circuitos Integrados Para su Mitigación y Explotación (VIGILANT-UPC)”, whose principal investigator is Prof. Antonio Rubio. This document also resumes the deliverables of the task 3.5, which are: D2.3a: Report of the integrated circuit used in the experimentation D.2.3b: Report on the experimental characterization of the sensor. D.2.3c: Report of the procedure to extract golden signatures from sensor measurements. D.2.3d: Report of the self-healing procedure developed. D2.3e: Report of the IC measurements. D2.3f: Report on the reliability-aware BIST and machine learning techniques for monitoring of TDV.