Electrical characterization of a-C:H as a dielectric material in metal/insulator/metal structures

The fabrication and electrical characterization of Metal- Insulator-Metal (MIM) structures, using a-C:H films as the insulating material, are presented in this work. These PECVD carbon films show a very low dielectric constant and a very high resistivity. The current conduction mechanisms were analy...

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Detalles Bibliográficos
Autores: CARLOS ZUÑIGA ISLAS, ANDREY KOSAREV, ALFONSO TORRES JACOME, PEDRO ROSALES QUINTERO, WILFRIDO CALLEJA ARRIAGA, FRANCISCO JAVIER DE LA HIDALGA WADE, OLEKSANDR MALIK
Tipo de recurso: artículo
Estado:Versión aceptada para publicación
Fecha de publicación:2010
País:México
Institución:Instituto Nacional de Astrofísica, Óptica y Electrónica
Repositorio:Repositorio Institucional del INAOE
Idioma:inglés
OAI Identifier:oai:inaoe.repositorioinstitucional.mx:1009/1524
Acceso en línea:http://inaoe.repositorioinstitucional.mx/jspui/handle/1009/1524
Access Level:acceso abierto
Palabra clave:info:eu-repo/classification/cti/1
info:eu-repo/classification/cti/22
info:eu-repo/classification/cti/2203
Descripción
Sumario:The fabrication and electrical characterization of Metal- Insulator-Metal (MIM) structures, using a-C:H films as the insulating material, are presented in this work. These PECVD carbon films show a very low dielectric constant and a very high resistivity. The current conduction mechanisms were analyzed before and after the post deposition annealing in pure argon ambient at 400°C. For as-deposited films, the experimental J-U curves showed that under low biasing regime (|U| < 8 V) the space charge limited current conduction is the main transport mechanism, whereas under higher biasing regime (|U| > 8 V)) the current transport is dominated by the Schottky mechanism. For annealed structures, under low and high biasing the ohmic and Schottky mechanisms were identified as the main processes for the electrical transport. Finally, we found that both parameters, the dielectric constant and resistivity, decrease slightly after the thermal annealing.