Determinación de la impedancia característica de líneas de transmisión en PCB considerando el efecto de las pérdidas debidas al conductor
Data transmission through PCB interconnects falls within the microwave frequency range for circuits used in high speed computing applications. In consequence, for carrying out the analysis that allows for the corresponding design, these interconnections are treated as transmission lines that can be...
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| Tipo de recurso: | tesis de maestría |
| Estado: | Versión aceptada para publicación |
| Fecha de publicación: | 2019 |
| País: | México |
| Institución: | Instituto Nacional de Astrofísica, Óptica y Electrónica |
| Repositorio: | Repositorio Institucional del INAOE |
| Idioma: | español |
| OAI Identifier: | oai:inaoe.repositorioinstitucional.mx:1009/1830 |
| Acceso en línea: | http://inaoe.repositorioinstitucional.mx/jspui/handle/1009/1830 |
| Access Level: | acceso abierto |
| Palabra clave: | info:eu-repo/classification/Inspec/Characteristic impedance info:eu-repo/classification/Inspec/PCB info:eu-repo/classification/Inspec/Transmission lines info:eu-repo/classification/cti/1 info:eu-repo/classification/cti/22 info:eu-repo/classification/cti/2203 |
| Sumario: | Data transmission through PCB interconnects falls within the microwave frequency range for circuits used in high speed computing applications. In consequence, for carrying out the analysis that allows for the corresponding design, these interconnections are treated as transmission lines that can be characterized from their fundamental parameters (i.e., the propagation constant and characteristic impedance). With this purpose, several research group have developed experimentally-based methods for obtaining these parameters. Nonetheless, for the case of the characteristic impedance, the problem has not been solved due to the difficult determination introduced by the effect of the electrical transitions required for measuring the required test structures. In this work, a proposal for experimentally obtaining the characteristic impedance is presented, whose knowledge is crucial for avoiding signal reflections and unmatched transitions within the system; besides, once the characteristic impedance is known, the appropriate characterization of the interconnects can be performed. Even though there exist different methods for calculating the characteristic impedance either from measured S-parameters or from propagation constant data, the main motivation of this work consists of including in the data processing previously neglected effects, such as the losses introduced by the conductor materials. This is achieved by including a term associated to the conductor losses that has not been previously considered. This method is physically based and is verified in different prototypes in which the line length and width, the position of the lines within the PCB, as well as the fiber weave pattern and the resin content of the dielectric laminate. Finally, good model–experiment correlation is achieved, where the maximum observed error is 1.5%. |
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