Modeling and simulation of successive breakdown events in thin gate dielectrics using standard reliability growth models

The application of constant electrical stress to a metal-insulator-semiconductor (MOS) or metal-insulator-metal (MIM) structure can generate multiple breakdown events in the dielectric film. Very often, these events are detected as small jumps in the current-time characteristic of the device under t...

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Detalles Bibliográficos
Autores: Miranda, E.|||0000-0003-0470-5318, Aguirre, Fernando Leonel|||0000-0001-7793-1194, Salvador, E., Bargallo Gonzalez, Mireia|||0000-0001-6792-4556, Campabadal, Francesca|||0000-0001-7758-4567, Suñé, Jordi|||0000-0003-0108-4907
Tipo de recurso: artículo
Fecha de publicación:2023
País:España
Institución:Universitat Autònoma de Barcelona
Repositorio:Dipòsit Digital de Documents de la UAB
Idioma:inglés
OAI Identifier:oai:ddd.uab.cat:285130
Acceso en línea:https://ddd.uab.cat/record/285130
https://dx.doi.org/urn:doi:10.1016/j.sse.2023.108812
Access Level:acceso abierto
Palabra clave:Dielectric breakdown
Oxide breakdown
MOS
MIM
Oxide reliability
Descripción
Sumario:The application of constant electrical stress to a metal-insulator-semiconductor (MOS) or metal-insulator-metal (MIM) structure can generate multiple breakdown events in the dielectric film. Very often, these events are detected as small jumps in the current-time characteristic of the device under test and can be treated from the stochastic viewpoint as a counting process. In this letter, a wide variety of standard reliability growth models for this process are assessed in order to determine which option provides the best simulation results compatible with the experimental observations. For the generation of the breakdown event arrivals, two alternative stochastic methods for the power-law Poisson process are investigated: first, the inversion algorithm for the cumulative distribution function and second, an on-the-fly method based on the so-called rejection algorithm. Though both methods are equivalent, the first one is more appropriate for data analysis using spreadsheet calculations while the second one is highly suitable for circuit simulation environments like LTSpice. The connection of the selected nonhomogeneous Poisson process with the Weibull model for dielectric breakdown is also discussed.