Curvature of BEOL cantilevers in CMOS-MEMS processes
© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to se...
| Autores: | , , , |
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| Tipo de recurso: | artículo |
| Fecha de publicación: | 2017 |
| País: | España |
| Institución: | Universitat Politècnica de Catalunya (UPC) |
| Repositorio: | UPCommons. Portal del coneixement obert de la UPC |
| Idioma: | inglés |
| OAI Identifier: | oai:upcommons.upc.edu:2117/115412 |
| Acceso en línea: | https://hdl.handle.net/2117/115412 https://dx.doi.org/10.1109/JMEMS.2017.2695571 |
| Access Level: | acceso abierto |
| Palabra clave: | Microelectromechanical systems Integrated circuits -- Design and construction Complementary metal-oxide semiconductor microelectromechanical systems (CMOS-MEMS) Bending stiffness Curvature Stacks Temperature Test cantilevers Sistemes microelectromecànics Circuits integrats -- Disseny i construcció Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica::Circuits integrats |
| Sumario: | © 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
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