Lignin as a High-Value Bioaditive in 3D-DLP Printable Acrylic Resins and Polyaniline Conductive Composite
With increasing environmental awareness, lignin will play a key role in the transition from the traditional materials industry towards sustainability and Industry 4.0, boosting the development of functional eco-friendly composites for future electronic devices. In this work, a detailed study of the...
| Autores: | , , , , , , |
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| Tipo de recurso: | artículo |
| Fecha de publicación: | 2022 |
| País: | España |
| Institución: | Universidad Complutense de Madrid (UCM) |
| Repositorio: | Docta Complutense |
| Idioma: | inglés |
| OAI Identifier: | oai:docta.ucm.es:20.500.14352/72386 |
| Acceso en línea: | https://hdl.handle.net/20.500.14352/72386 |
| Access Level: | acceso abierto |
| Palabra clave: | 547.1 544.163 665.94 Lignin DLP Polyaniline Filler dispersibility Additive manufacturing Acrylic resin Industria del plástico Química orgánica (Química) 3312.10 Plásticos 2306 Química Orgánica |
| Sumario: | With increasing environmental awareness, lignin will play a key role in the transition from the traditional materials industry towards sustainability and Industry 4.0, boosting the development of functional eco-friendly composites for future electronic devices. In this work, a detailed study of the effect of unmodified lignin on 3D printed light-curable acrylic composites was performed up to 4 wt.%. Lignin ratios below 3 wt.% could be easily and reproducibly printed on a digital light processing (DLP) printer, maintaining the flexibility and thermal stability of the pristine resin. These low lignin contents lead to 3D printed composites with smoother surfaces, improved hardness (Shore A increase ~5%), and higher wettability (contact angles decrease ~19.5%). Finally, 1 wt.% lignin was added into 3D printed acrylic resins containing 5 wt.% p-toluensulfonic doped polyaniline (pTSA-PANI). The lignin/pTSA-PANI/acrylic composite showed a clear improvement in the dispersion of the conductive filler, reducing the average surface roughness (Ra) by 61% and increasing the electrical conductivity by an order of magnitude (up to 10−6 S cm−1) compared to lignin free PANI composites. Thus, incorporating organosolv lignin from wood industry wastes as raw material into 3D printed photocurable resins represents a simple, low-cost potential application for the design of novel high-valued, bio-based products. |
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