Printability Study of a Conductive Polyaniline/Acrylic Formulation for 3D Printing

There is need for developing novel conductive polymers for Digital Light Processing (DLP) 3D printing. In this work, photorheology, in combination with Jacobs working curves, efficaciously predict the printability of polyaniline (PANI)/acrylate formulations with different contents of PANI and photoi...

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Detalhes bibliográficos
Autores: Arias Ferreiro, Goretti, Ares Pernas, Ana Isabel, Lasagabaster Latorre, Aurora, Aramburu Ocariz, Nora, Guerrica Echevarría, Gonzalo, Dopico García, Mª Sonia, Abad López, María José
Formato: artículo
Fecha de publicación:2021
País:España
Recursos:Universidad Complutense de Madrid (UCM)
Repositorio:Docta Complutense
Idioma:inglés
OAI Identifier:oai:docta.ucm.es:20.500.14352/7491
Acesso em linha:https://hdl.handle.net/20.500.14352/7491
Access Level:acceso abierto
Palavra-chave:547.1
678.675
577.112.38
Polyaniline
UV curing
Acrylic conductive composite
3D printing
Vat polymerization
DLP
Materiales
Química orgánica (Química)
3312 Tecnología de Materiales
2306 Química Orgánica
Descrição
Resumo:There is need for developing novel conductive polymers for Digital Light Processing (DLP) 3D printing. In this work, photorheology, in combination with Jacobs working curves, efficaciously predict the printability of polyaniline (PANI)/acrylate formulations with different contents of PANI and photoinitiator. The adjustment of the layer thickness according to cure depth values (Cd) allows printing of most formulations, except those with the highest gel point times determined by photorheology. In the working conditions, the maximum amount of PANI embedded within the resin was ≃3 wt% with a conductivity of 10−5 S cm−1, three orders of magnitude higher than the pure resin. Higher PANI loadings hinder printing quality without improving electrical conductivity. The optimal photoinitiator concentration was found between 6 and 7 wt%. The mechanical properties of the acrylic matrix are maintained in the composites, confirming the viability of these simple, low-cost, conductive composites for applications in flexible electronic devices.