Excimer laser induced deposition of copper from Cu(hfac)(TMVS)
Copper films have been deposited on TiN and fluoropolymer substrates from the KrF excimer-laser-assisted decomposition of Cu(hfac)(TMVS). Using H2 as the carrier gas, very uniform, shiny metal-like films were deposited with grain size of 50 to 100 nm. XPS measurements show that the precursor is redu...
| Autores: | , , , , |
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| Tipo de recurso: | artículo |
| Estado: | Versión aceptada para publicación |
| Fecha de publicación: | 1995 |
| País: | España |
| Institución: | Varias* (Consorci de Biblioteques Universitáries de Catalunya, Centre de Serveis Científics i Acadèmics de Catalunya) |
| Repositorio: | Recercat. Dipósit de la Recerca de Catalunya |
| OAI Identifier: | oai:recercat.cat:2445/98759 |
| Acceso en línea: | https://hdl.handle.net/2445/98759 |
| Access Level: | acceso abierto |
| Palabra clave: | Coure Làsers Pel·lícules metàl·liques Copper Lasers Metallic films |
| Sumario: | Copper films have been deposited on TiN and fluoropolymer substrates from the KrF excimer-laser-assisted decomposition of Cu(hfac)(TMVS). Using H2 as the carrier gas, very uniform, shiny metal-like films were deposited with grain size of 50 to 100 nm. XPS measurements show that the precursor is reduced to metallic copper, and that a Cu/C atomic ratio of up to 17 is obtained. |
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