Achieving high thermal conductivity in epoxy composites: Effect of boron nitride particle size and matrix-filler interface

For the thermal management of high watt density circuit layers, it is common to use a filled epoxy system to provide an electrically insulating but thermally conducting bond to a metal substrate. An epoxy-thiol system filled with boron nitride (BN), in the form of 2, 30 and 180 µm platelets, has bee...

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Autores: Moradi, Sasan|||0000-0002-3481-2889, Calventus Solé, Yolanda|||0000-0002-6216-5420, Román Concha, Frida Rosario|||0000-0001-7435-2402, Hutchinson, John M.|||0000-0003-0743-1260
Tipo de recurso: artículo
Fecha de publicación:2019
País:España
Institución:Universitat Politècnica de Catalunya (UPC)
Repositorio:UPCommons. Portal del coneixement obert de la UPC
Idioma:inglés
OAI Identifier:oai:upcommons.upc.edu:2117/166553
Acceso en línea:https://hdl.handle.net/2117/166553
https://dx.doi.org/10.3390/polym11071156
Access Level:acceso abierto
Palabra clave:Epoxy compounds
Thermal conductivity
Epoxy
Thiol
Boron nitride
Differential scanning calorimetry (DSC)
Compostos epòxids
Materials -- Propietats tèrmiques
Àrees temàtiques de la UPC::Enginyeria dels materials
Àrees temàtiques de la UPC::Física::Termodinàmica
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network_acronym_str ES
network_name_str España
repository_id_str
spelling Achieving high thermal conductivity in epoxy composites: Effect of boron nitride particle size and matrix-filler interfaceMoradi, Sasan|||0000-0002-3481-2889Calventus Solé, Yolanda|||0000-0002-6216-5420Román Concha, Frida Rosario|||0000-0001-7435-2402Hutchinson, John M.|||0000-0003-0743-1260Epoxy compoundsThermal conductivityEpoxyThiolBoron nitrideThermal conductivityDifferential scanning calorimetry (DSC)Compostos epòxidsMaterials -- Propietats tèrmiquesÀrees temàtiques de la UPC::Enginyeria dels materialsÀrees temàtiques de la UPC::Física::TermodinàmicaFor the thermal management of high watt density circuit layers, it is common to use a filled epoxy system to provide an electrically insulating but thermally conducting bond to a metal substrate. An epoxy-thiol system filled with boron nitride (BN), in the form of 2, 30 and 180 µm platelets, has been investigated with a view to achieving enhanced thermal conductivity. The effect of BN content on the cure reaction kinetics has been studied by differential scanning calorimetry and the thermal conductivity of the cured samples has been measured by the Transient Hot Bridge method. The heat of reaction and the glass transition temperature of the fully cured samples are both independent of the BN content, but the cure reaction kinetics is systematically affected by both BN content and particle size. These results can be correlated with the thermal conductivity of the cured systems, which is found to increase with both BN content and particle size. For a given BN content, the thermal conductivity found here is significantly higher than most others reported in the literature; this effect is attributed to a Lewis acid-base interaction between filler and matrix.Peer ReviewedMultidisciplinary Digital Publishing Institute (MDPI)20192019-07-0620192019-07-22journal articlehttp://purl.org/coar/resource_type/c_6501VoRhttp://purl.org/coar/version/c_970fb48d4fbd8a85info:eu-repo/semantics/articleapplication/pdfhttps://hdl.handle.net/2117/166553https://dx.doi.org/10.3390/polym11071156reponame:UPCommons. Portal del coneixement obert de la UPCinstname:Universitat Politècnica de Catalunya (UPC)Inglésengopen accesshttp://purl.org/coar/access_right/c_abf2Attribution 3.0 Spainhttp://creativecommons.org/licenses/by/3.0/es/info:eu-repo/semantics/openAccessoai:upcommons.upc.edu:2117/1665532026-05-27T15:37:01Z
dc.title.none.fl_str_mv Achieving high thermal conductivity in epoxy composites: Effect of boron nitride particle size and matrix-filler interface
title Achieving high thermal conductivity in epoxy composites: Effect of boron nitride particle size and matrix-filler interface
spellingShingle Achieving high thermal conductivity in epoxy composites: Effect of boron nitride particle size and matrix-filler interface
Moradi, Sasan|||0000-0002-3481-2889
Epoxy compounds
Thermal conductivity
Epoxy
Thiol
Boron nitride
Thermal conductivity
Differential scanning calorimetry (DSC)
Compostos epòxids
Materials -- Propietats tèrmiques
Àrees temàtiques de la UPC::Enginyeria dels materials
Àrees temàtiques de la UPC::Física::Termodinàmica
title_short Achieving high thermal conductivity in epoxy composites: Effect of boron nitride particle size and matrix-filler interface
title_full Achieving high thermal conductivity in epoxy composites: Effect of boron nitride particle size and matrix-filler interface
title_fullStr Achieving high thermal conductivity in epoxy composites: Effect of boron nitride particle size and matrix-filler interface
title_full_unstemmed Achieving high thermal conductivity in epoxy composites: Effect of boron nitride particle size and matrix-filler interface
title_sort Achieving high thermal conductivity in epoxy composites: Effect of boron nitride particle size and matrix-filler interface
dc.creator.none.fl_str_mv Moradi, Sasan|||0000-0002-3481-2889
Calventus Solé, Yolanda|||0000-0002-6216-5420
Román Concha, Frida Rosario|||0000-0001-7435-2402
Hutchinson, John M.|||0000-0003-0743-1260
author Moradi, Sasan|||0000-0002-3481-2889
author_facet Moradi, Sasan|||0000-0002-3481-2889
Calventus Solé, Yolanda|||0000-0002-6216-5420
Román Concha, Frida Rosario|||0000-0001-7435-2402
Hutchinson, John M.|||0000-0003-0743-1260
author_role author
author2 Calventus Solé, Yolanda|||0000-0002-6216-5420
Román Concha, Frida Rosario|||0000-0001-7435-2402
Hutchinson, John M.|||0000-0003-0743-1260
author2_role author
author
author
dc.subject.none.fl_str_mv Epoxy compounds
Thermal conductivity
Epoxy
Thiol
Boron nitride
Thermal conductivity
Differential scanning calorimetry (DSC)
Compostos epòxids
Materials -- Propietats tèrmiques
Àrees temàtiques de la UPC::Enginyeria dels materials
Àrees temàtiques de la UPC::Física::Termodinàmica
topic Epoxy compounds
Thermal conductivity
Epoxy
Thiol
Boron nitride
Thermal conductivity
Differential scanning calorimetry (DSC)
Compostos epòxids
Materials -- Propietats tèrmiques
Àrees temàtiques de la UPC::Enginyeria dels materials
Àrees temàtiques de la UPC::Física::Termodinàmica
description For the thermal management of high watt density circuit layers, it is common to use a filled epoxy system to provide an electrically insulating but thermally conducting bond to a metal substrate. An epoxy-thiol system filled with boron nitride (BN), in the form of 2, 30 and 180 µm platelets, has been investigated with a view to achieving enhanced thermal conductivity. The effect of BN content on the cure reaction kinetics has been studied by differential scanning calorimetry and the thermal conductivity of the cured samples has been measured by the Transient Hot Bridge method. The heat of reaction and the glass transition temperature of the fully cured samples are both independent of the BN content, but the cure reaction kinetics is systematically affected by both BN content and particle size. These results can be correlated with the thermal conductivity of the cured systems, which is found to increase with both BN content and particle size. For a given BN content, the thermal conductivity found here is significantly higher than most others reported in the literature; this effect is attributed to a Lewis acid-base interaction between filler and matrix.
publishDate 2019
dc.date.none.fl_str_mv 2019
2019-07-06
2019
2019-07-22
dc.type.none.fl_str_mv journal article
http://purl.org/coar/resource_type/c_6501
VoR
http://purl.org/coar/version/c_970fb48d4fbd8a85
dc.type.openaire.fl_str_mv info:eu-repo/semantics/article
format article
dc.identifier.none.fl_str_mv https://hdl.handle.net/2117/166553
https://dx.doi.org/10.3390/polym11071156
url https://hdl.handle.net/2117/166553
https://dx.doi.org/10.3390/polym11071156
dc.language.none.fl_str_mv Inglés
eng
language_invalid_str_mv Inglés
language eng
dc.rights.none.fl_str_mv open access
http://purl.org/coar/access_right/c_abf2
Attribution 3.0 Spain
http://creativecommons.org/licenses/by/3.0/es/
dc.rights.openaire.fl_str_mv info:eu-repo/semantics/openAccess
rights_invalid_str_mv open access
http://purl.org/coar/access_right/c_abf2
Attribution 3.0 Spain
http://creativecommons.org/licenses/by/3.0/es/
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
dc.publisher.none.fl_str_mv Multidisciplinary Digital Publishing Institute (MDPI)
publisher.none.fl_str_mv Multidisciplinary Digital Publishing Institute (MDPI)
dc.source.none.fl_str_mv reponame:UPCommons. Portal del coneixement obert de la UPC
instname:Universitat Politècnica de Catalunya (UPC)
instname_str Universitat Politècnica de Catalunya (UPC)
reponame_str UPCommons. Portal del coneixement obert de la UPC
collection UPCommons. Portal del coneixement obert de la UPC
repository.name.fl_str_mv
repository.mail.fl_str_mv
_version_ 1869418407032520704
score 15.300724

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