Epoxy-thiol systems filled with boron nitride for high thermal conductivity applications

An epoxy-thiol system filled with boron nitride (BN), in the form of 80 µm agglomerates, has been investigated with a view to achieving enhanced thermal conductivity. The effect of BN content on the cure reaction kinetics has been studied by differential scanning calorimetry (DSC) and the thermal co...

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Detalles Bibliográficos
Autores: Hutchinson, John M.|||0000-0003-0743-1260, Román Concha, Frida Rosario|||0000-0001-7435-2402, Folch, Adrià
Tipo de recurso: artículo
Fecha de publicación:2018
País:España
Institución:Universitat Politècnica de Catalunya (UPC)
Repositorio:UPCommons. Portal del coneixement obert de la UPC
Idioma:inglés
OAI Identifier:oai:upcommons.upc.edu:2117/118040
Acceso en línea:https://hdl.handle.net/2117/118040
https://dx.doi.org/10.3390/polym10030340
Access Level:acceso abierto
Palabra clave:Epoxy compounds--Testing
Thermal conductivity
Boron nitride
Calorimetry
Epoxy
Thiol
Differential scanning calorimetry (DSC)
Epòxids
Calor -- Conducció
Nitrur de bor
Àrees temàtiques de la UPC::Enginyeria dels materials::Assaig de materials
Descripción
Sumario:An epoxy-thiol system filled with boron nitride (BN), in the form of 80 µm agglomerates, has been investigated with a view to achieving enhanced thermal conductivity. The effect of BN content on the cure reaction kinetics has been studied by differential scanning calorimetry (DSC) and the thermal conductivity of the cured samples has been measured by the transient hot bridge method. The heat of reaction and the glass transition temperature of the fully cured samples are both independent of the BN content, but the cure reaction kinetics is not: with increasing BN content, the reaction first advances and is then delayed, this behaviour being more pronounced than for the same system with 6 µm BN particles, investigated previously. This dependence on BN content is attributed to the effects of heat transfer, and the DSC results can be correlated with the thermal conductivity of the cured systems, which is found to increase with both BN content and BN particle size. For a given BN content, the values of thermal conductivity obtained are significantly higher than many others reported in the literature, and achieve a value of over 4.0 W/mK for a BN content of about 40 vol %.