Graphene patterning by nanosecond laser ablation: the effect of the substrate interaction with graphene

This paper focuses on the development of patterned graphene/substrate by means of green nanosecond pulse laser irradiation. Monolayer graphene samples supported on a Si/SiO2 substrate were patterned using 532 nm laser irradiation under fluence conditions ranging from 31 mJ/cm2 and to 4240 mJ/cm2. Ra...

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Detalles Bibliográficos
Autores: Pérez Mas, Ana Matilde, Álvarez Rodríguez, Patricia, Campos, Nuria, Gómez, David, Menéndez López, Rosa María
Tipo de recurso: artículo
Estado:Versión aceptada para publicación
Fecha de publicación:2016
País:España
Institución:Consejo Superior de Investigaciones Científicas (CSIC)
Repositorio:DIGITAL.CSIC. Repositorio Institucional del CSIC
OAI Identifier:oai:digital.csic.es:10261/155088
Acceso en línea:http://hdl.handle.net/10261/155088
Access Level:acceso abierto
Palabra clave:CVD Graphene
Laser scribing
Nanosecond laser
Pulsed laser
Descripción
Sumario:This paper focuses on the development of patterned graphene/substrate by means of green nanosecond pulse laser irradiation. Monolayer graphene samples supported on a Si/SiO2 substrate were patterned using 532 nm laser irradiation under fluence conditions ranging from 31 mJ/cm2 and to 4240 mJ/cm2. Raman spectroscopy was used to investigate the effect of laser irradiation on the graphene. It was found that at 356 mJ/cm2 selective ablation of the graphene occurs. However, at fluence values above 1030 mJ/cm2 (when damage to the substrate is observed) no ablation of the graphene takes place. In contrast, its graphenic structure was found to have been modified. Only at fluence values where the ablation of the substrate occurs, is graphene eliminated in an area almost equivalent to that of the ablated substrate. In this case, additional damage to the graphene sheet edges is produced. The increment in the number of oxygenated functional groups in these regions, as measured by XPS spectroscopy, suggests that this damage is probably caused by thermal phenomena during the ablation of the substrate.