3D thermal-aware floorplanner using a MOEA approximation
Two of the major concerns in 3D stacked technology are heat removal and power density distribution. In our work, we propose a novel 3D thermal-aware floorplanner. Our contributions include: 1. A novel multi-objective formulation to consider the thermal and performance constraints in the optimization...
| Autores: | , , , |
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| Tipo de recurso: | artículo |
| Fecha de publicación: | 2013 |
| País: | España |
| Institución: | Universidad Complutense de Madrid (UCM) |
| Repositorio: | Docta Complutense |
| Idioma: | inglés |
| OAI Identifier: | oai:docta.ucm.es:20.500.14352/113287 |
| Acceso en línea: | https://hdl.handle.net/20.500.14352/113287 |
| Access Level: | acceso abierto |
| Palabra clave: | Hardware 3304 Tecnología de Los Ordenadores |
| Sumario: | Two of the major concerns in 3D stacked technology are heat removal and power density distribution. In our work, we propose a novel 3D thermal-aware floorplanner. Our contributions include: 1. A novel multi-objective formulation to consider the thermal and performance constraints in the optimization approach. 2. Two efficient Multi-Objective Evolutionary Algorithm (MOEA) for the representation of the floorplanning model and for the optimization of thermal parameters and wire length. 3. A smooth integration of the MOEA model with an accurate thermal modelling of the architecture. The experimental work is conducted for two realistic many-core single-chip architectures: an homogeneous system resembling INTEL’s SCC, and an improved heterogeneous setup. The results show promising improvements of the mean and peak temperature, as well as the thermal gradient, with a reduced overhead in the wire length of the system. |
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