Implementation of advanced characterization techniques for assessment of grinding effects on the surface integrity of WC-Co cemened carbides

Grinding is a key step on the manufacturing process of WC–Co cemented carbides (hardmetals). In this work, an investigation of grinding effects on the surface integrity of hardmetals is conducted. It is done by combining diverse advanced characterisation techniques: X-ray diffraction, field emission...

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Detalhes bibliográficos
Autores: Yang, Jing, Roa Rovira, Joan Josep|||0000-0002-7440-0766, Schwind, Martin, Odén, Magnus, Johansson Joesaar, M.P, Esteve, Joan, Llanes Pitarch, Luis Miguel|||0000-0003-1054-1073
Formato: artículo
Fecha de publicación:2018
País:España
Recursos:Universitat Politècnica de Catalunya (UPC)
Repositorio:UPCommons. Portal del coneixement obert de la UPC
Idioma:inglés
OAI Identifier:oai:upcommons.upc.edu:2117/119308
Acesso em linha:https://hdl.handle.net/2117/119308
Access Level:acceso abierto
Palavra-chave:Grinding and polishing
Carbides
Residual stresses
Grinding
cemented carbides
surface integrity
3D tomography
residual stresses
binder phase
Carburs
Àrees temàtiques de la UPC::Enginyeria dels materials
Descrição
Resumo:Grinding is a key step on the manufacturing process of WC–Co cemented carbides (hardmetals). In this work, an investigation of grinding effects on the surface integrity of hardmetals is conducted. It is done by combining diverse advanced characterisation techniques: X-ray diffraction, field emission-scanning electron microscopy, electron back scatter diffraction, focused ion beam – 3D tomography and transmission electron microscopy. The study is carried out in a fine-grained WC–Co grade. Besides ground state, polished surface finish condition is assessed for comparison purposes. It is evidenced that grinding induces significant alterations: 3D tomography illustrates microcracking exists down to 2.5 µm depth with a highly anisotropic distribution at the subsurface, large compressive residual stresses extending until subsurface levels of about 12 µm, and phase transformation of binder from the original fcc phase into the hcp one, as well as severe plastic deformation observed within the binder at the surface level.