Implementation of advanced characterization techniques for assessment of grinding effects on the surface integrity of WC-Co cemened carbides
Grinding is a key step on the manufacturing process of WC–Co cemented carbides (hardmetals). In this work, an investigation of grinding effects on the surface integrity of hardmetals is conducted. It is done by combining diverse advanced characterisation techniques: X-ray diffraction, field emission...
| Authors: | , , , , , , |
|---|---|
| Format: | article |
| Publication Date: | 2018 |
| Country: | España |
| Institution: | Universitat Politècnica de Catalunya (UPC) |
| Repository: | UPCommons. Portal del coneixement obert de la UPC |
| Language: | English |
| OAI Identifier: | oai:upcommons.upc.edu:2117/119308 |
| Online Access: | https://hdl.handle.net/2117/119308 |
| Access Level: | Open access |
| Keyword: | Grinding and polishing Carbides Residual stresses Grinding cemented carbides surface integrity 3D tomography residual stresses binder phase Carburs Àrees temàtiques de la UPC::Enginyeria dels materials |
| Summary: | Grinding is a key step on the manufacturing process of WC–Co cemented carbides (hardmetals). In this work, an investigation of grinding effects on the surface integrity of hardmetals is conducted. It is done by combining diverse advanced characterisation techniques: X-ray diffraction, field emission-scanning electron microscopy, electron back scatter diffraction, focused ion beam – 3D tomography and transmission electron microscopy. The study is carried out in a fine-grained WC–Co grade. Besides ground state, polished surface finish condition is assessed for comparison purposes. It is evidenced that grinding induces significant alterations: 3D tomography illustrates microcracking exists down to 2.5 µm depth with a highly anisotropic distribution at the subsurface, large compressive residual stresses extending until subsurface levels of about 12 µm, and phase transformation of binder from the original fcc phase into the hcp one, as well as severe plastic deformation observed within the binder at the surface level. |
|---|