Thermoelectric microsensor based on ultrathin Si films

We show the use as a thermal photosensor of a thermoelectric (TE) microsensor based on ultrathin suspended Si films. The reduced thickness of the structural films enhances the extremely large thermal insulation of the sensing area (~43 µW/K), since phonons scatter in the surfaces, and guarantees a r...

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Detalles Bibliográficos
Autores: Gonçalves Dalkiranis Pereira, Gustavo, Ferrando-Villalba, Pablo|||0000-0002-0858-531X, Lopeandia, Aitor|||0000-0003-0566-8299, Abad, Llibertat|||0000-0003-2637-8629, Rodríguez-Viejo, Javier|||0000-0002-9735-263X
Tipo de recurso: artículo
Fecha de publicación:2018
País:España
Institución:Universitat Autònoma de Barcelona
Repositorio:Dipòsit Digital de Documents de la UAB
Idioma:inglés
OAI Identifier:oai:ddd.uab.cat:216973
Acceso en línea:https://ddd.uab.cat/record/216973
https://dx.doi.org/urn:doi:10.3390/proceedings2131517
Access Level:acceso abierto
Palabra clave:Photosensor
Thermoelectric effect and microsensor
Descripción
Sumario:We show the use as a thermal photosensor of a thermoelectric (TE) microsensor based on ultrathin suspended Si films. The reduced thickness of the structural films enhances the extremely large thermal insulation of the sensing area (~43 µW/K), since phonons scatter in the surfaces, and guarantees a reduced thermal mass (in the µJ/K range). The sensitivity of the device is evaluated by heating with an argon laser (λ = 457 nm) in the range 0-10 mW, reaching sensitivities of around 6 × 108 V/(W·m2) in high vacuum conditions and 5 × 107 V/(W·m2) in environments of air at atmospheric pressure. Open circuit voltage measurements with and without light illumination with a 406 nm diode laser operating at 4 mW were conducted at temperature differences up to 50 K between the central hot region and the Si frame. The slight decrease of the Seebeck coefficient is related to the increase of carriers by photogeneration.