Progress in a-Si:H/c-Si heterojunction emitters obtained by Hot-Wire CVD at 200°C

In this work, we investigate heterojunction emitters deposited by Hot-Wire CVD on p-type crystalline silicon. The emitter structure consists of an n-doped film (20 nm) combined with a thin intrinsic hydrogenated amorphous silicon buffer layer (5 nm). The microstructure of these films has been studie...

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Detalles Bibliográficos
Autores: Muñoz Ramos, David, Voz Sánchez, Cristóbal, Martin Garcia, Isidro, Orpella, Albert, Puigdollers i González, Joaquim, Alcubilla González, Ramón, Villar, Fernando, Bertomeu i Balagueró, Joan, Andreu i Batallé, Jordi, Damon-Lacoste, J., Roca i Cabarrocas, P. (Pere)
Tipo de recurso: artículo
Estado:Versión aceptada para publicación
Fecha de publicación:2008
País:España
Institución:Varias* (Consorci de Biblioteques Universitáries de Catalunya, Centre de Serveis Científics i Acadèmics de Catalunya)
Repositorio:Recercat. Dipósit de la Recerca de Catalunya
OAI Identifier:oai:recercat.cat:2445/47285
Acceso en línea:https://hdl.handle.net/2445/47285
Access Level:acceso abierto
Palabra clave:Deposició química en fase vapor
Cèl·lules solars
Teoria quàntica
Microelectrònica
Chemical vapor deposition
Solar cells
Quantum theory
Microelectronics
Descripción
Sumario:In this work, we investigate heterojunction emitters deposited by Hot-Wire CVD on p-type crystalline silicon. The emitter structure consists of an n-doped film (20 nm) combined with a thin intrinsic hydrogenated amorphous silicon buffer layer (5 nm). The microstructure of these films has been studied by spectroscopic ellipsometry in the UV-visible range. These measurements reveal that the microstructure of the n-doped film is strongly influenced by the amorphous silicon buffer. The Quasy-Steady-State Photoconductance (QSS-PC) technique allows us to estimate implicit open-circuit voltages near 700 mV for heterojunction emitters on p-type (0.8 Ω·cm) FZ silicon wafers. Finally, 1 cm 2 heterojunction solar cells with 15.4% conversion efficiencies (total area) have been fabricated on flat p-type (14 Ω·cm) CZ silicon wafers with aluminum back-surface-field contact.