Thermal phase lag heterodyne infrared imaging for current tracking in radio frequency integrated circuits

With thermal phase lag measurements, current paths are tracked in a Class A radio frequency (RF) power amplifier at 2 GHz. The amplifier is heterodynally driven at 440 MHz and 2 GHz, and its resulting thermal field was inspected, respectively, at 1013 and 113 Hz with an infrared lock-in thermography...

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Detalles Bibliográficos
Autores: Perpiñà Gilabet, Xavier, León, Javier, Altet Sanahujes, Josep|||0000-0002-6939-6475, Vellvehi, Miquel, Reverter Cubarsí, Ferran|||0000-0003-1653-0519, Barajas Ojeda, Enrique|||0000-0002-2072-2268, Jordà, Xavier
Tipo de recurso: artículo
Fecha de publicación:2017
País:España
Institución:Universitat Politècnica de Catalunya (UPC)
Repositorio:UPCommons. Portal del coneixement obert de la UPC
Idioma:inglés
OAI Identifier:oai:upcommons.upc.edu:2117/102649
Acceso en línea:https://hdl.handle.net/2117/102649
https://dx.doi.org/10.1063/1.4977175
Access Level:acceso abierto
Palabra clave:Integrated circuits
Radio frequency
Amplifiers
Heterodyne detectors
Radiofrequency power transmission
MOSFETs
Energy use
Circuits integrats
Radiofreqüència
Àrees temàtiques de la UPC::Enginyeria electrònica::Circuits electrònics
Descripción
Sumario:With thermal phase lag measurements, current paths are tracked in a Class A radio frequency (RF) power amplifier at 2 GHz. The amplifier is heterodynally driven at 440 MHz and 2 GHz, and its resulting thermal field was inspected, respectively, at 1013 and 113 Hz with an infrared lock-in thermography system. The phase lag maps evidence with a higher sensitivity than thermal amplitude measurements an input-output loop due to a substrate capacitive coupling. This limits the amplifier’s performance, raising the power consumption in certain components. Other information relative to local power consumption and amplifier operation is also inferred. This approach allows the local non-invasive testing of integrated systems regardless of their operating frequency.