On the influence of fabrication tolerances in Terahertz photoconductive antennas

© 2025 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to se...

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Autores: Vega Piña, Sara|||0000-0002-4853-7929, Nuño Gómez, Daniel-Juan|||0000-0002-2418-6351, Chang, Yi, Gómez Díaz, J. Sebastián, Santos Blanco, M. Concepción|||0000-0002-5103-5356
Tipo de recurso: artículo
Fecha de publicación:2025
País:España
Institución:Universitat Politècnica de Catalunya (UPC)
Repositorio:UPCommons. Portal del coneixement obert de la UPC
Idioma:inglés
OAI Identifier:oai:upcommons.upc.edu:2117/428594
Acceso en línea:https://hdl.handle.net/2117/428594
https://dx.doi.org/10.1109/TTHZ.2025.3558962
Access Level:acceso abierto
Palabra clave:Substrates
Principal component analysis
Antenna radiation patterns
Dipole antennas
Antenna measurements
Terahertz radiation
Lenses
Geometry
Fabrication
Semiconductor device measurement
Photoconductive antennas
Substrate lens
Thz spectrometry.
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spelling On the influence of fabrication tolerances in Terahertz photoconductive antennasVega Piña, Sara|||0000-0002-4853-7929Nuño Gómez, Daniel-Juan|||0000-0002-2418-6351Chang, YiGómez Díaz, J. SebastiánSantos Blanco, M. Concepción|||0000-0002-5103-5356SubstratesPrincipal component analysisAntenna radiation patternsDipole antennasAntenna measurementsTerahertz radiationLensesGeometryFabricationSemiconductor device measurementPhotoconductive antennasSubstrate lensThz spectrometry.© 2025 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.We present a study of the radiation pattern of photoconductive antennas (PCA) subject to substrate chip defects, aiming at characterizing fabrication tolerances. We show that the asymmetries observed over the cross-polar radiation patterns may be exploited to numerically estimate the most prominent trends of the substrate chip geometrical imperfections. A Figure of Merit (FoM) has been defined, characterized and validated through simulations and experimental measures, proving it is sensitive to both the magnitude and location of the substrate irregularities. The study has been focused on two kinds of substrate defects, the angled dicing and the off-centered antenna gap, and it has considered three planar antenna geometries: dipole, bow-tie and Sierpinski triangle dipole. A numerical antenna factor related to the planar antenna geometry imprinted over the substrate is included in the FoM expression for fair comparison of substrate irregularities among PCAs with different metallic patterns. A simple setup for experimentally obtaining the value of the FoM through collimated beam raster scanning measure of the cross-polar radiation pattern has been proved useful to validate the practical relevance of the FoM. These values asses the substrate chip fabrication quality and help to identify the position and magnitude of the substrate defects that have the greatest impact on the PCA performance.This work was supported by the Spanish Ministerio de Ciencia e In- novaci´on (MICINN) thanks to the project PID2019-107885GB-C31 VER- SONET (RTI2018-097051), the Catalan Research Group grant 2017 SGR 219 and the University and Research Aid Management Agency (AGAUR) with pre-doctoral grant 2021 FISDU 00094 to the first author. (Corresponding author: Sara Vega)Peer ReviewedInstitute of Electrical and Electronics Engineers (IEEE)20252025-01-0120252025-04-29journal articlehttp://purl.org/coar/resource_type/c_6501VoRhttp://purl.org/coar/version/c_970fb48d4fbd8a85info:eu-repo/semantics/articleapplication/pdfhttps://hdl.handle.net/2117/428594https://dx.doi.org/10.1109/TTHZ.2025.3558962reponame:UPCommons. Portal del coneixement obert de la UPCinstname:Universitat Politècnica de Catalunya (UPC)InglésengAgencia Estatal de Investigación http://doi.org/10.13039/501100011033 Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020 PID2019-107885GB-C31 SISTEMAS RADIANTES X-WAVE INTEGRADAS DE COMUNICACIONES Y SENSORIZACIONopen accesshttp://purl.org/coar/access_right/c_abf2info:eu-repo/semantics/openAccessoai:upcommons.upc.edu:2117/4285942026-05-27T15:37:01Z
dc.title.none.fl_str_mv On the influence of fabrication tolerances in Terahertz photoconductive antennas
title On the influence of fabrication tolerances in Terahertz photoconductive antennas
spellingShingle On the influence of fabrication tolerances in Terahertz photoconductive antennas
Vega Piña, Sara|||0000-0002-4853-7929
Substrates
Principal component analysis
Antenna radiation patterns
Dipole antennas
Antenna measurements
Terahertz radiation
Lenses
Geometry
Fabrication
Semiconductor device measurement
Photoconductive antennas
Substrate lens
Thz spectrometry.
title_short On the influence of fabrication tolerances in Terahertz photoconductive antennas
title_full On the influence of fabrication tolerances in Terahertz photoconductive antennas
title_fullStr On the influence of fabrication tolerances in Terahertz photoconductive antennas
title_full_unstemmed On the influence of fabrication tolerances in Terahertz photoconductive antennas
title_sort On the influence of fabrication tolerances in Terahertz photoconductive antennas
dc.creator.none.fl_str_mv Vega Piña, Sara|||0000-0002-4853-7929
Nuño Gómez, Daniel-Juan|||0000-0002-2418-6351
Chang, Yi
Gómez Díaz, J. Sebastián
Santos Blanco, M. Concepción|||0000-0002-5103-5356
author Vega Piña, Sara|||0000-0002-4853-7929
author_facet Vega Piña, Sara|||0000-0002-4853-7929
Nuño Gómez, Daniel-Juan|||0000-0002-2418-6351
Chang, Yi
Gómez Díaz, J. Sebastián
Santos Blanco, M. Concepción|||0000-0002-5103-5356
author_role author
author2 Nuño Gómez, Daniel-Juan|||0000-0002-2418-6351
Chang, Yi
Gómez Díaz, J. Sebastián
Santos Blanco, M. Concepción|||0000-0002-5103-5356
author2_role author
author
author
author
dc.subject.none.fl_str_mv Substrates
Principal component analysis
Antenna radiation patterns
Dipole antennas
Antenna measurements
Terahertz radiation
Lenses
Geometry
Fabrication
Semiconductor device measurement
Photoconductive antennas
Substrate lens
Thz spectrometry.
topic Substrates
Principal component analysis
Antenna radiation patterns
Dipole antennas
Antenna measurements
Terahertz radiation
Lenses
Geometry
Fabrication
Semiconductor device measurement
Photoconductive antennas
Substrate lens
Thz spectrometry.
description © 2025 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
publishDate 2025
dc.date.none.fl_str_mv 2025
2025-01-01
2025
2025-04-29
dc.type.none.fl_str_mv journal article
http://purl.org/coar/resource_type/c_6501
VoR
http://purl.org/coar/version/c_970fb48d4fbd8a85
dc.type.openaire.fl_str_mv info:eu-repo/semantics/article
format article
dc.identifier.none.fl_str_mv https://hdl.handle.net/2117/428594
https://dx.doi.org/10.1109/TTHZ.2025.3558962
url https://hdl.handle.net/2117/428594
https://dx.doi.org/10.1109/TTHZ.2025.3558962
dc.language.none.fl_str_mv Inglés
eng
language_invalid_str_mv Inglés
language eng
dc.relation.none.fl_str_mv Agencia Estatal de Investigación http://doi.org/10.13039/501100011033 Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020 PID2019-107885GB-C31 SISTEMAS RADIANTES X-WAVE INTEGRADAS DE COMUNICACIONES Y SENSORIZACION
dc.rights.none.fl_str_mv open access
http://purl.org/coar/access_right/c_abf2
dc.rights.openaire.fl_str_mv info:eu-repo/semantics/openAccess
rights_invalid_str_mv open access
http://purl.org/coar/access_right/c_abf2
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
dc.publisher.none.fl_str_mv Institute of Electrical and Electronics Engineers (IEEE)
publisher.none.fl_str_mv Institute of Electrical and Electronics Engineers (IEEE)
dc.source.none.fl_str_mv reponame:UPCommons. Portal del coneixement obert de la UPC
instname:Universitat Politècnica de Catalunya (UPC)
instname_str Universitat Politècnica de Catalunya (UPC)
reponame_str UPCommons. Portal del coneixement obert de la UPC
collection UPCommons. Portal del coneixement obert de la UPC
repository.name.fl_str_mv
repository.mail.fl_str_mv
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score 15.811543

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