Sn-0.5Cu(-x)Al solder alloys: Microstructure-related aspects and tensile properties responses

In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such...

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Autores: Lima, Thiago Soares, de Gouveia, Guilherme Lisboa, Septimio, Rudimylla da Silva, da Cruz, Clarissa Barros, Silva, Bismarck Luiz, Brito, Crystopher [UNESP], Spinelli, José Eduardo, Cheung, Noé
Tipo de recurso: artículo
Estado:Versión publicada
Fecha de publicación:2019
País:Brasil
Institución:Universidade Estadual Paulista (UNESP)
Repositorio:Repositório Institucional da UNESP
Idioma:inglés
OAI Identifier:oai:repositorio.unesp.br:11449/187423
Acceso en línea:http://dx.doi.org/10.3390/met9020241
http://hdl.handle.net/11449/187423
Access Level:acceso abierto
Palabra clave:Microstructure
Sn-Cu-Al alloys
Solidification
Tensile strength
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spelling Sn-0.5Cu(-x)Al solder alloys: Microstructure-related aspects and tensile properties responsesMicrostructureSn-Cu-Al alloysSolidificationTensile strengthIn this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such as the dimensions of primary, λ 1 , and secondary, λ 2 , dendritic arrays, and intermetallic compounds (IMCs) morphologies were comparatively assessed for the three tested compositions, that is, Sn-0.5wt.%Cu, Sn-0.5wt.%Cu-0.05wt.%Al, and Sn-0.5wt.%Cu-0.1wt.%Al alloys. Al addition affected neither the primary dendritic spacing nor the types of morphologies identified for the Cu 6 Sn 5 IMC, which was found to be either globular or fibrous regardless of the alloy considered. Secondary dendrite arm spacing was found to be enlarged and the eutectic fraction was reduced with an increase in the Al-content. Tensile properties remained unaffected with the addition of Al, except for the improvement in ductility of up to 40% when compared to the Sn-0.5wt.%Cu alloy without Al trace. A smaller λ 2 in size was demonstrated to be the prime microstructure parameter associated with the beneficial effect on the strength of the Sn-0.5wt.%Cu(-x)Al alloys.Fundação de Amparo à Pesquisa do Estado do AmazonasFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)Department of Manufacturing and Materials Engineering University of Campinas-UNICAMPDepartment of Materials Engineering Federal University of São Carlos-UFSCarDepartment of Materials Engineering Federal University of Rio Grande do Norte-UFRNSão Paulo State University-UNESP, Campus of São João da Boa VistaSão Paulo State University-UNESP, Campus of São João da Boa VistaFAPESP: 2015/11863-5FAPESP: 2016/18186-1FAPESP: 2017/12741-6CNPq: 307830/2017-9CNPq: 407978/2018-6Universidade Estadual de Campinas (UNICAMP)Universidade Federal de São Carlos (UFSCar)Federal University of Rio Grande do Norte-UFRNUniversidade Estadual Paulista (Unesp)2019-10-06T15:35:43Z2019-10-06T15:35:43Z2019-02-01info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articlehttp://dx.doi.org/10.3390/met9020241Metals, v. 9, n. 2, 2019.2075-4701http://hdl.handle.net/11449/18742310.3390/met90202412-s2.0-85062414403Scopusreponame:Repositório Institucional da UNESPinstname:Universidade Estadual Paulista (UNESP)instacron:UNESPengMetalsinfo:eu-repo/semantics/openAccessLima, Thiago Soaresde Gouveia, Guilherme LisboaSeptimio, Rudimylla da Silvada Cruz, Clarissa BarrosSilva, Bismarck LuizBrito, Crystopher [UNESP]Spinelli, José EduardoCheung, Noé2025-04-03T15:36:24Zoai:repositorio.unesp.br:11449/187423Repositório InstitucionalPUBhttp://repositorio.unesp.br/oai/requestrepositoriounesp@unesp.bropendoar:29462025-04-03T15:36:24Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)false
dc.title.none.fl_str_mv Sn-0.5Cu(-x)Al solder alloys: Microstructure-related aspects and tensile properties responses
title Sn-0.5Cu(-x)Al solder alloys: Microstructure-related aspects and tensile properties responses
spellingShingle Sn-0.5Cu(-x)Al solder alloys: Microstructure-related aspects and tensile properties responses
Lima, Thiago Soares
Microstructure
Sn-Cu-Al alloys
Solidification
Tensile strength
title_short Sn-0.5Cu(-x)Al solder alloys: Microstructure-related aspects and tensile properties responses
title_full Sn-0.5Cu(-x)Al solder alloys: Microstructure-related aspects and tensile properties responses
title_fullStr Sn-0.5Cu(-x)Al solder alloys: Microstructure-related aspects and tensile properties responses
title_full_unstemmed Sn-0.5Cu(-x)Al solder alloys: Microstructure-related aspects and tensile properties responses
title_sort Sn-0.5Cu(-x)Al solder alloys: Microstructure-related aspects and tensile properties responses
dc.creator.none.fl_str_mv Lima, Thiago Soares
de Gouveia, Guilherme Lisboa
Septimio, Rudimylla da Silva
da Cruz, Clarissa Barros
Silva, Bismarck Luiz
Brito, Crystopher [UNESP]
Spinelli, José Eduardo
Cheung, Noé
author Lima, Thiago Soares
author_facet Lima, Thiago Soares
de Gouveia, Guilherme Lisboa
Septimio, Rudimylla da Silva
da Cruz, Clarissa Barros
Silva, Bismarck Luiz
Brito, Crystopher [UNESP]
Spinelli, José Eduardo
Cheung, Noé
author_role author
author2 de Gouveia, Guilherme Lisboa
Septimio, Rudimylla da Silva
da Cruz, Clarissa Barros
Silva, Bismarck Luiz
Brito, Crystopher [UNESP]
Spinelli, José Eduardo
Cheung, Noé
author2_role author
author
author
author
author
author
author
dc.contributor.none.fl_str_mv Universidade Estadual de Campinas (UNICAMP)
Universidade Federal de São Carlos (UFSCar)
Federal University of Rio Grande do Norte-UFRN
Universidade Estadual Paulista (Unesp)
dc.subject.por.fl_str_mv Microstructure
Sn-Cu-Al alloys
Solidification
Tensile strength
topic Microstructure
Sn-Cu-Al alloys
Solidification
Tensile strength
description In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such as the dimensions of primary, λ 1 , and secondary, λ 2 , dendritic arrays, and intermetallic compounds (IMCs) morphologies were comparatively assessed for the three tested compositions, that is, Sn-0.5wt.%Cu, Sn-0.5wt.%Cu-0.05wt.%Al, and Sn-0.5wt.%Cu-0.1wt.%Al alloys. Al addition affected neither the primary dendritic spacing nor the types of morphologies identified for the Cu 6 Sn 5 IMC, which was found to be either globular or fibrous regardless of the alloy considered. Secondary dendrite arm spacing was found to be enlarged and the eutectic fraction was reduced with an increase in the Al-content. Tensile properties remained unaffected with the addition of Al, except for the improvement in ductility of up to 40% when compared to the Sn-0.5wt.%Cu alloy without Al trace. A smaller λ 2 in size was demonstrated to be the prime microstructure parameter associated with the beneficial effect on the strength of the Sn-0.5wt.%Cu(-x)Al alloys.
publishDate 2019
dc.date.none.fl_str_mv 2019-10-06T15:35:43Z
2019-10-06T15:35:43Z
2019-02-01
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://dx.doi.org/10.3390/met9020241
Metals, v. 9, n. 2, 2019.
2075-4701
http://hdl.handle.net/11449/187423
10.3390/met9020241
2-s2.0-85062414403
url http://dx.doi.org/10.3390/met9020241
http://hdl.handle.net/11449/187423
identifier_str_mv Metals, v. 9, n. 2, 2019.
2075-4701
10.3390/met9020241
2-s2.0-85062414403
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv Metals
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.source.none.fl_str_mv Scopus
reponame:Repositório Institucional da UNESP
instname:Universidade Estadual Paulista (UNESP)
instacron:UNESP
instname_str Universidade Estadual Paulista (UNESP)
instacron_str UNESP
institution UNESP
reponame_str Repositório Institucional da UNESP
collection Repositório Institucional da UNESP
repository.name.fl_str_mv Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)
repository.mail.fl_str_mv repositoriounesp@unesp.br
_version_ 1853671534218969088
score 15,301603

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