Cita APA

Lima, T. S., de Gouveia, G. L., Septimio, R. d. S., da Cruz, C. B., Silva, B. L., Brito, C. [., . . . Cheung, N. (2019). Sn-0.5Cu(-x)Al solder alloys: Microstructure-related aspects and tensile properties responses.

Citación estilo Chicago

Lima, Thiago Soares, Guilherme Lisboa de Gouveia, Rudimylla da Silva Septimio, Clarissa Barros da Cruz, Bismarck Luiz Silva, Crystopher [UNESP] Brito, José Eduardo Spinelli, y Noé Cheung. Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-related Aspects and Tensile Properties Responses. 2019.

Cita MLA

Lima, Thiago Soares, et al. Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-related Aspects and Tensile Properties Responses. 2019.