Low-frequency noise investigation of n-channel 3D devices
In this paper, the low-frequency (LF) noise in standard n-channel triple-gate Bulk FinFETs has been experimentally investigated with variation in the fin widths (W<inf>Fin</inf>), channel lengths (L) and gate dielectric. The origin of the noise will be analyzed in order to understand the...
| Autores: | , , , |
|---|---|
| Tipo de recurso: | artículo |
| Estado: | Versión publicada |
| Fecha de publicación: | 2015 |
| País: | Brasil |
| Institución: | Universidade Estadual Paulista (UNESP) |
| Repositorio: | Repositório Institucional da UNESP |
| Idioma: | inglés |
| OAI Identifier: | oai:repositorio.unesp.br:11449/177340 |
| Acceso en línea: | http://dx.doi.org/10.1016/j.mee.2015.04.047 http://hdl.handle.net/11449/177340 |
| Access Level: | acceso abierto |
| Palabra clave: | 3D devices Bulk FinFET Flicker noise Generation-recombination noise Low-frequency noise |
| Sumario: | In this paper, the low-frequency (LF) noise in standard n-channel triple-gate Bulk FinFETs has been experimentally investigated with variation in the fin widths (W<inf>Fin</inf>), channel lengths (L) and gate dielectric. The origin of the noise will be analyzed in order to understand the physical mechanisms involved in 3D device architectures. Although the device scaling brings the idea of noise reduction, we show the opposite behavior because already single electron trapping has a marked impact on the device operation. Significant variation in the noise spectral density has been observed, which is related to the random occurrence of excess Lorentzian components (1/f<sup>2</sup>-like), associated with generation-recombination (GR) noise. In addition, the gate-voltage-dependent GR noise peaks have been studied, which are assigned to gate oxide traps. |
|---|