Compositional stability of hafnium aluminates thin films deposited on Si by atomic layer deposition

We have used nuclear reaction analyses and Rutherford backscattering spectrometry to investigate quantitatively the compositional stability of hafnium aluminate thin films deposited on Sis001d by atomic layer deposition using HfCl4/H2O and AlsCH3d3/H2O precursors. It was found that increasing Al/Hf...

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Detalles Bibliográficos
Autores: Driemeier, Carlos Eduardo, Bastos, Karen Paz, Miotti, Leonardo, Baumvol, Israel Jacob Rabin, Nguyen, N. V., Sayan, S., Krug, Cristiano
Tipo de recurso: artículo
Estado:Versión publicada
Fecha de publicación:2005
País:Brasil
Institución:Universidade Federal do Rio Grande do Sul (UFRGS)
Repositorio:Repositório Institucional da UFRGS
Idioma:inglés
OAI Identifier:oai:www.lume.ufrgs.br:10183/141320
Acceso en línea:http://hdl.handle.net/10183/141320
Access Level:acceso abierto
Palabra clave:Alumina
Filmes finos dieletricos
Recozimento térmico rápido
Retroespalhamento rutherford
Estequiometria
Descripción
Sumario:We have used nuclear reaction analyses and Rutherford backscattering spectrometry to investigate quantitatively the compositional stability of hafnium aluminate thin films deposited on Sis001d by atomic layer deposition using HfCl4/H2O and AlsCH3d3/H2O precursors. It was found that increasing Al/Hf deposition cycles ratio leads to increasing oxygen deficiency in the as-deposited films as well as to increasing metal losses sup to ,15%d from the films after rapid thermal annealing at 1000 °C. Furthermore, isotopic substitution experiments, showed that incorporation of oxygen from the gas phase is eased in the cases where deposition conditions failed to supply enough oxygen to complete oxides stoichiometry.