Morphology of copper deposits obtained by metallic electrodeposition
Electrochemical deposition of copper from copper nitrate aqueous electrolyte on graphite substrate was investigated at current densities between 0.03 mA/cm2 - 1.36 mA/cm2 and in the voltage range of 3 V to 15 V. The surface morphology and elemental composition of the resultant deposit were character...
| Autores: | , , , , |
|---|---|
| Tipo de recurso: | artículo |
| Estado: | Versión publicada |
| Fecha de publicación: | 2015 |
| País: | Argentina |
| Institución: | Consejo Nacional de Investigaciones Científicas y Técnicas |
| Repositorio: | CONICET Digital (CONICET) |
| Idioma: | inglés |
| OAI Identifier: | oai:ri.conicet.gov.ar:11336/43790 |
| Acceso en línea: | http://hdl.handle.net/11336/43790 |
| Access Level: | acceso abierto |
| Palabra clave: | ELECTRODEPOSITION EMPA SUPERFICIAL MORPHOLOGY COPPER https://purl.org/becyt/ford/1.4 https://purl.org/becyt/ford/1 |
| Sumario: | Electrochemical deposition of copper from copper nitrate aqueous electrolyte on graphite substrate was investigated at current densities between 0.03 mA/cm2 - 1.36 mA/cm2 and in the voltage range of 3 V to 15 V. The surface morphology and elemental composition of the resultant deposit were characterized by electron microprobe analysis (EMPA). These images illustrate the influence of current density on the shape of copper electrodeposited on the electrode surface. Rods, polyhedral bodies, pentagonal pyramids, dendritics, spiked spheres or cauliflower-like shapes are observed depending on the electrodeposition conditions. |
|---|