Formation of Cu and Ni Nanowires by Electrodeposition

In this work, the formation of Cu and Ni nanowires by electrodeposition inside alumina templates was analyzed. The depositswere performed from CuSO4 + H2SO4 and NiSO4 + NiCl2 + H3BO3 + H2SO4 solutions for the electrodeposition of Cu and Ni,respectively. To allow the cations deposition, sufficiently...

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Detalles Bibliográficos
Autores: Meier, Lorena Alejandra, Alvarez, Andrea Elizabeth, Garcia, S.G., del Barrio, Maria Cecilia
Tipo de recurso: artículo
Estado:Versión publicada
Fecha de publicación:2015
País:Argentina
Institución:Consejo Nacional de Investigaciones Científicas y Técnicas
Repositorio:CONICET Digital (CONICET)
Idioma:inglés
OAI Identifier:oai:ri.conicet.gov.ar:11336/40479
Acceso en línea:http://hdl.handle.net/11336/40479
Access Level:acceso abierto
Palabra clave:Nanowires
Electrodeposition
Aluminium Oxide Template
Copper
https://purl.org/becyt/ford/1.4
https://purl.org/becyt/ford/1
Descripción
Sumario:In this work, the formation of Cu and Ni nanowires by electrodeposition inside alumina templates was analyzed. The depositswere performed from CuSO4 + H2SO4 and NiSO4 + NiCl2 + H3BO3 + H2SO4 solutions for the electrodeposition of Cu and Ni,respectively. To allow the cations deposition, sufficiently negative potentials were used. The experience time was rangedbetween 500s and 1h. After the metal electrodeposition, the sample was immersed in NaOH to dissolve the alumina membraneand to expose the generated deposit. The obtained nanostructures were characterized by SEM (scanning electron microscopy).Deposits were corresponded with nanowires having an average diameter of 300 nm. The length of the nanostructures was about10 microns.