Identifying and characterizing the impact of high-order effects in the signal propagation on PCB interconnects
High-speed electronic systems are demanding reliable interconnections to serve as communication channels not only inside a chip, but also between chips. For this reason, studying the performance of these interconnects is mandatory these days for optimizing the corresponding structures. As the freque...
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| Tipo de recurso: | tesis de maestría |
| Estado: | Versión aceptada para publicación |
| Fecha de publicación: | 2009 |
| País: | México |
| Institución: | Instituto Nacional de Astrofísica, Óptica y Electrónica |
| Repositorio: | Repositorio Institucional del INAOE |
| Idioma: | inglés |
| OAI Identifier: | oai:inaoe.repositorioinstitucional.mx:1009/456 |
| Acceso en línea: | http://inaoe.repositorioinstitucional.mx/jspui/handle/1009/456 |
| Access Level: | acceso abierto |
| Palabra clave: | info:eu-repo/classification/Packaging/Packaging info:eu-repo/classification/Microstrip lines/Microstrip lines info:eu-repo/classification/Dispositivos de microondas/Microwave devices info:eu-repo/classification/cti/1 info:eu-repo/classification/cti/22 info:eu-repo/classification/cti/2203 |
| Sumario: | High-speed electronic systems are demanding reliable interconnections to serve as communication channels not only inside a chip, but also between chips. For this reason, studying the performance of these interconnects is mandatory these days for optimizing the corresponding structures. As the frequency of operation of electronic systems increases, however, this task is becoming more complicated due to the high-order effects that occur within interconnects at these frequencies. For this reason, studying the most important high-order effects in interconnects is the purpose of this thesis. Thus, within this project several prototypes were fabricated to carry out an exhaustive analysis of the origins of resonances, parasitic mode excitation and propagation, and other sources of signal degradation in a practical interconnect implemented on PCB. The analysis includes experimental study of these structures but also full-wave simulation of 3D models corresponding to the devices under examination. From the obtained results effects in the proper propagation of high-speed signals within a practical channel, is observed the dramatic impact of the high-order, which provides valuable insights about the physical phenomena associated with the electrical behavior of interconnects, from simple transmission lines to complex packages. |
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