Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering

This paper describes the fabrication opportunities that Printed Circuit Boards (PCBs) offer for electronic and biomedical engineering. Historically, PCB substrates have been used to support the components of the electronic devices, linking them using copper lines, and providing input and output pads...

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Detalles Bibliográficos
Autores: Perdigones Sánchez, Francisco, Quero Reboul, José Manuel
Tipo de recurso: artículo
Estado:Versión publicada
Fecha de publicación:2022
País:España
Institución:Universidad de Sevilla (US)
Repositorio:idUS. Depósito de Investigación de la Universidad de Sevilla
OAI Identifier:oai:idus.us.es:11441/134933
Acceso en línea:https://hdl.handle.net/11441/134933
https://doi.org/10.3390/mi13030460
Access Level:acceso abierto
Palabra clave:Printed Circuit Board (PCB)
Biomedical
Electronic
Engineering
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spelling Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical EngineeringPerdigones Sánchez, FranciscoQuero Reboul, José ManuelPrinted Circuit Board (PCB)BiomedicalElectronicEngineeringThis paper describes the fabrication opportunities that Printed Circuit Boards (PCBs) offer for electronic and biomedical engineering. Historically, PCB substrates have been used to support the components of the electronic devices, linking them using copper lines, and providing input and output pads to connect the rest of the system. In addition, this kind of substrate is an emerging material for biomedical engineering thanks to its many interesting characteristics, such as its commercial availability at a low cost with very good tolerance and versatility, due to its multilayer characteristics; that is, the possibility of using several metals and substrate layers. The alternative uses of copper, gold, Flame Retardant 4 (FR4) and silver layers, together with the use of vias, solder masks and a rigid and flexible substrate, are noted. Among other uses, these characteristics have been using to develop many sensors, biosensors and actuators, and PCB-based lab-on chips; for example, deoxyribonucleic acid (DNA) amplification devices for Polymerase Chain Reaction (PCR). In addition, several applications of these devices are going to be noted in this paper, and two tables summarizing the layers’ functions are included in the discussion: the first one for metallic layers, and the second one for the vias, solder mask, flexible and rigid substrate functions.Junta de Andalucía-Consejería de Economía y Conocimiento P18-RT-1745Universidad de SevillaMDPIIngeniería Electrónica2022info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionapplication/pdfapplication/pdfhttps://hdl.handle.net/11441/134933https://doi.org/10.3390/mi13030460reponame:idUS. Depósito de Investigación de la Universidad de Sevillainstname:Universidad de Sevilla (US)InglésMicromachines, 13 (3), 460.P18-RT-1745https://www.mdpi.com/2072-666X/13/3/460info:eu-repo/semantics/openAccessoai:idus.us.es:11441/1349332026-06-17T12:51:07Z
dc.title.none.fl_str_mv Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering
title Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering
spellingShingle Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering
Perdigones Sánchez, Francisco
Printed Circuit Board (PCB)
Biomedical
Electronic
Engineering
title_short Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering
title_full Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering
title_fullStr Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering
title_full_unstemmed Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering
title_sort Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering
dc.creator.none.fl_str_mv Perdigones Sánchez, Francisco
Quero Reboul, José Manuel
author Perdigones Sánchez, Francisco
author_facet Perdigones Sánchez, Francisco
Quero Reboul, José Manuel
author_role author
author2 Quero Reboul, José Manuel
author2_role author
dc.contributor.none.fl_str_mv Ingeniería Electrónica
dc.subject.none.fl_str_mv Printed Circuit Board (PCB)
Biomedical
Electronic
Engineering
topic Printed Circuit Board (PCB)
Biomedical
Electronic
Engineering
description This paper describes the fabrication opportunities that Printed Circuit Boards (PCBs) offer for electronic and biomedical engineering. Historically, PCB substrates have been used to support the components of the electronic devices, linking them using copper lines, and providing input and output pads to connect the rest of the system. In addition, this kind of substrate is an emerging material for biomedical engineering thanks to its many interesting characteristics, such as its commercial availability at a low cost with very good tolerance and versatility, due to its multilayer characteristics; that is, the possibility of using several metals and substrate layers. The alternative uses of copper, gold, Flame Retardant 4 (FR4) and silver layers, together with the use of vias, solder masks and a rigid and flexible substrate, are noted. Among other uses, these characteristics have been using to develop many sensors, biosensors and actuators, and PCB-based lab-on chips; for example, deoxyribonucleic acid (DNA) amplification devices for Polymerase Chain Reaction (PCR). In addition, several applications of these devices are going to be noted in this paper, and two tables summarizing the layers’ functions are included in the discussion: the first one for metallic layers, and the second one for the vias, solder mask, flexible and rigid substrate functions.
publishDate 2022
dc.date.none.fl_str_mv 2022
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv https://hdl.handle.net/11441/134933
https://doi.org/10.3390/mi13030460
url https://hdl.handle.net/11441/134933
https://doi.org/10.3390/mi13030460
dc.language.none.fl_str_mv Inglés
language_invalid_str_mv Inglés
dc.relation.none.fl_str_mv Micromachines, 13 (3), 460.
P18-RT-1745
https://www.mdpi.com/2072-666X/13/3/460
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
application/pdf
dc.publisher.none.fl_str_mv MDPI
publisher.none.fl_str_mv MDPI
dc.source.none.fl_str_mv reponame:idUS. Depósito de Investigación de la Universidad de Sevilla
instname:Universidad de Sevilla (US)
instname_str Universidad de Sevilla (US)
reponame_str idUS. Depósito de Investigación de la Universidad de Sevilla
collection idUS. Depósito de Investigación de la Universidad de Sevilla
repository.name.fl_str_mv
repository.mail.fl_str_mv
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score 15,300719

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