Nanostructured Ti thin films by magnetron sputtering at oblique angles

The growth of Ti thin films by the magnetron sputtering technique at oblique angles and at room temperature is analysed from both experimental and theoretical points of view. Unlike other materials deposited in similar conditions, the nanostructure development of the Ti layers exhibits an anomalous...

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Detalles Bibliográficos
Autores: Álvarez Molina, Rafael, García-Martín, José Miguel, García-Valenzuela, Aurelio, Macías Montero, Manuel Jesús, Ferrer Fernández, Francisco Javier, Santiso, José, Cotrino Bautista, José, Rico-Gavira, Víctor Joaquín, Rodríguez González-Elipe, Agustín, Palmero Acebedo, Alberto
Tipo de recurso: artículo
Estado:Versión enviada para evaluación y publicación
Fecha de publicación:2015
País:España
Institución:Universidad de Sevilla (US)
Repositorio:idUS. Depósito de Investigación de la Universidad de Sevilla
OAI Identifier:oai:idus.us.es:11441/83819
Acceso en línea:https://hdl.handle.net/11441/83819
https://doi.org/10.1088/0022-3727/49/4/045303
Access Level:acceso abierto
Descripción
Sumario:The growth of Ti thin films by the magnetron sputtering technique at oblique angles and at room temperature is analysed from both experimental and theoretical points of view. Unlike other materials deposited in similar conditions, the nanostructure development of the Ti layers exhibits an anomalous behaviour when varying both the angle of incidence of the deposition flux and the deposition pressure. At low pressures, a sharp transition from compact to isolated, vertically aligned, nanocolumns is obtained when the angle of incidence surpasses a critical threshold. Remarkably, this transition also occurs when solely increasing the deposition pressure under certain conditions. By the characterization of the Ti layers, the realization of fundamental experiments and the use of a simple growth model, we demonstrate that surface mobilization processes associated to a highly directed momentum distribution and the relatively high kinetic energy of sputtered atoms are responsible for this behaviour