Design and physical implementation of a distributed clock module for an EtherCAT slave controller

This report covers the development of the Distributed Clock module, following every design stage until a manufacturable layout was achieved. The module was designed independently of the main chip, so it does not explain deeply external blocks. Even so, an introduction to the EtherCAT protocol and th...

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Detalles Bibliográficos
Autor: Feo i Saün, Pau
Tipo de recurso: tesis de maestría
Fecha de publicación:2025
País:España
Institución:Universitat Politècnica de Catalunya (UPC)
Repositorio:UPCommons. Portal del coneixement obert de la UPC
Idioma:inglés
OAI Identifier:oai:upcommons.upc.edu:2117/442487
Acceso en línea:https://hdl.handle.net/2117/442487
Access Level:acceso abierto
Palabra clave:Integrated circuits -- Design and construction
Microelectronics
Device drivers (Computer programs)
Circuits integrats -- Disseny i construcció
Microelectrònica
Programes controladors
Àrees temàtiques de la UPC::Enginyeria electrònica
Descripción
Sumario:This report covers the development of the Distributed Clock module, following every design stage until a manufacturable layout was achieved. The module was designed independently of the main chip, so it does not explain deeply external blocks. Even so, an introduction to the EtherCAT protocol and the EtherCAT Slave Controller, together with its sub functions, are included. Also, a thorough explanation of the distributed clock is also provided to ensure a complete understanding of how this logic block operates. In addition, an extend explanation of some methodologies were developed for certain chip functions, such as drift, which was refined to give the system the best possible adaptability. The classical digital‑chip flow was followed: writing RTL code, validating it with testbenches, and synthesizing it into a gate‑level netlist using DC Compiler. Also, obtaining some preliminary estimations of area, power, and timing. The final step, the physical implementation or the chip layout design was completed with Encounter. The project concludes successfully with a final layout supported by solid area and power reports. Future steps are the integration of the module with the main chip and prepare the design for fabrication.