New BN-epoxy composites obtained by thermal latent cationic curing with enhanced thermal conductivity

A series of boron nitride (BN) composites, with different BN content, were prepared and characterized by cationic curing of DGEBA/BN formulations. As cationic initiator a commercial benzylanilinium salt was used. This cationic system shows good latent characteristics that were not lost on adding the...

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Detalhes bibliográficos
Autores: Isarn Garcia, Isaac|||0000-0003-4387-4595, Massagués, Lluís, Ramis Juan, Xavier|||0000-0003-2550-7185, Serra Albet, Maria Àngels|||0000-0003-1387-0358, Ferrando Piera, Francesc|||0000-0003-4450-2734
Tipo de documento: artigo
Data de publicação:2017
País:España
Recursos:Universitat Politècnica de Catalunya (UPC)
Repositório:UPCommons. Portal del coneixement obert de la UPC
Idioma:inglês
OAI Identifier:oai:upcommons.upc.edu:2117/108322
Acesso em linha:https://hdl.handle.net/2117/108322
https://dx.doi.org/10.1016/j.compositesa.2017.09.007
Access Level:Acceso aberto
Palavra-chave:Thermodynamics
Polymeric composites
Layered structures
Mechanical properties
Polymer-matrix composites (PMCs)
Thermosetting resin
Termodinàmica
Compostos polimèrics
Àrees temàtiques de la UPC::Enginyeria dels materials::Materials plàstics i polímers
Àrees temàtiques de la UPC::Enginyeria química::Química orgànica
Descrição
Resumo:A series of boron nitride (BN) composites, with different BN content, were prepared and characterized by cationic curing of DGEBA/BN formulations. As cationic initiator a commercial benzylanilinium salt was used. This cationic system shows good latent characteristics that were not lost on adding the filler. The performance of the catalytic system was optimized by varying the amount of initiator and adding little proportions of glycerol. The kinetics of the curing process was evaluated by calorimetric measurements. The addition of BN allowed increasing thermal conductivity without loss of mechanical properties like Young modulus, impact resistance, adhesion and other thermal characteristics like Tg or thermal stability. In addition, dielectric properties were improved with the increment of filler.