Contactless pick-and-place of millimetric objects using inverted near-field acoustic levitation
We model and realize an ultrasonic contactless pick-and-place device capable of picking, self-centering, self-orienting, translating, and releasing flat millimetric objects. The device is an ultrasonic Langevin transducer operating at 21 kHz that radiates into air through a tapered tip. Objects are...
| Autores: | , , , |
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| Formato: | artículo |
| Estado: | Versión publicada |
| Fecha de publicación: | 2020 |
| País: | España |
| Recursos: | Universidad Pública de Navarra |
| Repositorio: | Academica-e. Repositorio Institucional de la Universidad Pública de Navarra |
| OAI Identifier: | oai:academica-e.unavarra.es:2454/36988 |
| Acesso em linha: | https://hdl.handle.net/2454/36988 |
| Access Level: | acceso abierto |
| Palavra-chave: | Acoustic levitation Acoustic phenomena Acoustic radiation pressure Computational fluid dynamics Acoustic modeling Simulation Analysis Navier Stokes equations |
| Resumo: | We model and realize an ultrasonic contactless pick-and-place device capable of picking, self-centering, self-orienting, translating, and releasing flat millimetric objects. The device is an ultrasonic Langevin transducer operating at 21 kHz that radiates into air through a tapered tip. Objects are trapped few micrometers below the tip due to the near-field acoustic levitation phenomenon. We first investigate the conditions to achieve an attractive force on the object depending on its size and the device operating frequency. Second, we use a 3D acoustic model that describes the converging forces and torque that provide the self-centering and self-orienting capabilities. Third, a more advanced Computational Fluid Dynamics model based on the Navier-Stokes equations explains the small gap between the tip and the trapped object. The contactless manipulation capabilities of the device are demonstrated by picking, transporting, and releasing a Surface Mount Device in air. The presented manipulation concept can be an interesting alternative for manipulating delicate objects such as microelectromechanical devices, silicon dies, or micro-optical devices. |
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