Development of a multimaterial additive manufacturing process for electronic devices
In order to increase the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combining 3D printing technology by DLP (Digital Light Processing) with a two-dimensional Drop-on-Demand Inkjet printing system. Through DLP technology base...
| Autores: | , , , , , , , , |
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| Tipo de recurso: | artículo |
| Fecha de publicación: | 2017 |
| País: | España |
| Institución: | Universitat Politècnica de Catalunya (UPC) |
| Repositorio: | UPCommons. Portal del coneixement obert de la UPC |
| Idioma: | inglés |
| OAI Identifier: | oai:upcommons.upc.edu:2117/111320 |
| Acceso en línea: | https://hdl.handle.net/2117/111320 https://dx.doi.org/10.1016/j.promfg.2017.09.180 |
| Access Level: | acceso abierto |
| Palabra clave: | Three-dimensional printing Technology applications Additive Manufacturing Multimaterial Printing Electronics Impressió 3D Tecnologia -- Aplicacions industrials Àrees temàtiques de la UPC::Enginyeria mecànica |
| Sumario: | In order to increase the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combining 3D printing technology by DLP (Digital Light Processing) with a two-dimensional Drop-on-Demand Inkjet printing system. Through DLP technology based on digital micromirror devices (DMDs) it is possible to build up 3D geometries layer-by-layer using polymerization of photosensitive resins. Concurrently, while the construction process is performed, the InkJet printing system is used to deposit tiny drops of conductive inks on the substrate generated, which will thus constitute an electric circuit embedded within the three dimensional structure. On the other hand, photosensitive resins have been filled with Low Temperature Co-firing Ceramic (LTCC) particles, in order to modify the basis properties of the part by using sinterizable slurries. Finally the challenges in the sintering process for achieving functional parts are discussed and a few prototypes have been built in order to validate this technology. |
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