Alternative methods to attach components in printed circuit boards to improve their recyclability

Printed circuit boards (PCB), which form the basis of the elect ronics industry, generate wastes that are difficult to dispose of and recycle due to the diversity of their materials and components and thei r difficult separation. The replacement of Pb-Sn welding for le ad-free alloys to attach compo...

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Detalles Bibliográficos
Autores: Canal Marques, André, Cabrera Marrero, José M.|||0000-0001-8417-1736, Malfatti, Célia de Fraga, Ortega Vega, Maria Rita
Tipo de recurso: artículo
Fecha de publicación:2014
País:España
Institución:Universitat Politècnica de Catalunya (UPC)
Repositorio:UPCommons. Portal del coneixement obert de la UPC
Idioma:inglés
OAI Identifier:oai:upcommons.upc.edu:2117/25202
Acceso en línea:https://hdl.handle.net/2117/25202
https://dx.doi.org/10.15446/dyna.v81n186.39760
Access Level:acceso abierto
Palabra clave:Printed circuit boards
Welding replacement
Environmental pro blem
Recyclability.
Circuits impresos
Reciclatge (Residus, etc.)
Àrees temàtiques de la UPC::Enginyeria dels materials
Descripción
Sumario:Printed circuit boards (PCB), which form the basis of the elect ronics industry, generate wastes that are difficult to dispose of and recycle due to the diversity of their materials and components and thei r difficult separation. The replacement of Pb-Sn welding for le ad-free alloys to attach components in printed circuit boards is an att empt to minimize the problem of Pb toxicity, but it does not ch ange the problem of separation of the components for later reuse and/or recycling. This article presents a review of the environmental problem of printed circuit boards, the initial development of alternative fixation studies, and reliability tests for comparison with con ventional boards and commercial systems to validate or serve as a basis for futu re research, focused on PCB disassembly for recycling. At prese nt, initial studies were performed by using prototypes for visual and funct ional tests.