Revealing Fast Cu-Ion Transport and Enhanced Conductivity at the CuInP2S6-In4/3P2S6 Heterointerface
Van der Waals layered ferroelectrics, such as CuInP2S6 (CIPS), offer a versatile platform for miniaturization of ferroelectric device technology. Control of the targeted composition and kinetics of CIPS synthesis, enables the formation of stable self-assembled heterostructures of ferroelectric CIPS...
| Autores: | , , , , , , , , , , |
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| Tipo de recurso: | artículo |
| Estado: | Versión aceptada para publicación |
| Fecha de publicación: | 2022 |
| País: | España |
| Institución: | Varias* (Consorci de Biblioteques Universitáries de Catalunya, Centre de Serveis Científics i Acadèmics de Catalunya) |
| Repositorio: | Recercat. Dipósit de la Recerca de Catalunya |
| OAI Identifier: | oai:recercat.cat:2445/197427 |
| Acceso en línea: | https://hdl.handle.net/2445/197427 |
| Access Level: | acceso abierto |
| Palabra clave: | Microscòpia electrònica d'escombratge Nanotecnologia Microscòpia de força atòmica Scanning electron microscopy Nanotechnology Atomic force microscopy |
| Sumario: | Van der Waals layered ferroelectrics, such as CuInP2S6 (CIPS), offer a versatile platform for miniaturization of ferroelectric device technology. Control of the targeted composition and kinetics of CIPS synthesis, enables the formation of stable self-assembled heterostructures of ferroelectric CIPS and non-ferroelectric In4/3P2S6 (IPS). Here, we use advanced quantitative scanning probe microscopy and density-functional-theory to explore in detail the nanoscale variability in dynamic functional properties of the CIPS-IPS heterostructure. We report evidence of fast ionic transport mediating an appreciable out-of-plane electromechanical response of CIPS in the paraelectric phase. Further, we map the local dielectric constant and ionic conductivity on the nanoscale as we thermally stimulate the ferroelectric-paraelectric phase transition, recovering the bulk dielectric peak of the transition at the nanoscale. Finally, we discover a conductivity enhancement at the CIPS/IPS interface, indicating the possibility of engineering its interfacial properties for next generation device applications. |
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