Curing kinetics of acrylate-based and 3D printable IPNs

In this work, the kinetics of curing of a new family of interpenetrating polymer networks (IPNs) obtained by co-formulation of a photocurable acrylic resin with a thermocurable epoxy/anhydride mixture is studied. The first curing stage is an acrylate free-radical photopolymerization at ambient tempe...

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Detalles Bibliográficos
Autores: Konuray, Ali Osman|||0000-0001-7281-006X, Salla Tarragó, José María|||0000-0002-5409-8416, Morancho Llena, José María|||0000-0002-9416-3657, Fernández Francos, Xavier|||0000-0002-3492-2922, García Álvarez, Montserrat|||0000-0003-2279-3649, Ramis Juan, Xavier|||0000-0003-2550-7185
Tipo de recurso: artículo
Fecha de publicación:2020
País:España
Institución:Universitat Politècnica de Catalunya (UPC)
Repositorio:UPCommons. Portal del coneixement obert de la UPC
Idioma:inglés
OAI Identifier:oai:upcommons.upc.edu:2117/334298
Acceso en línea:https://hdl.handle.net/2117/334298
https://dx.doi.org/10.1016/j.tca.2020.178754
Access Level:acceso abierto
Palabra clave:Heat resistant plastics
Epoxy resins
Three-dimensional printing
Acrylate
Epoxy
Dual-curing
Thermosets
Stereolithography
Plàstics termostables
Resines epoxídiques
Impressió 3D
Àrees temàtiques de la UPC::Enginyeria dels materials
Àrees temàtiques de la UPC::Enginyeria dels materials::Materials plàstics i polímers
Àrees temàtiques de la UPC::Física
Descripción
Sumario:In this work, the kinetics of curing of a new family of interpenetrating polymer networks (IPNs) obtained by co-formulation of a photocurable acrylic resin with a thermocurable epoxy/anhydride mixture is studied. The first curing stage is an acrylate free-radical photopolymerization at ambient temperature, and the second curing stage is an epoxy-anhydride copolymerization initiated with a nucleophilic tertiary amine at higher temperatures. The presence of a diperoxyketal thermal radical initiator added to the liquid formulation facilitates uniform and complete acrylate conversion during thermal second curing stage and opens the possibility of curing the same materials by thermal curing only. The thermal curing kinetics was studied by integral isoconversional and model fitting procedures, whereas photocuring kinetics was satisfactorily fitted to a first order expression. Thermal curing and storage stability at room temperature were successfully simulated by using the isoconversional kinetic parameters. These ternary formulations have potential as 3D printable thermosets.