Thermal Stability of Cu-Al-Ni Shape Memory Alloy Thin Films Obtained by Nanometer Multilayer Deposition

Cu-Al-Ni is a high-temperature shape memory alloy (HTSMA) with exceptional thermomechanical properties, making it an ideal active material for engineering new technologies able to operate at temperatures up to 200 °C. Recent studies revealed that these alloys exhibit a robust superelastic behavior a...

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Autores: Gómez Cortés, José Fernando, Nó Sánchez, María Luisa, Chuvilin, Andrey, Ruiz Larrea, María Isabel, San Juan Núñez, José María
Tipo de recurso: artículo
Fecha de publicación:2023
País:España
Institución:Universidad del País Vasco
Repositorio:Addi. Archivo Digital para la Docencia y la Investigación
OAI Identifier:oai:addi.ehu.eus:10810/62737
Acceso en línea:http://hdl.handle.net/10810/62737
Access Level:acceso abierto
Palabra clave:shape memory alloys (SMA)
Cu-Al-Ni
e-beam evaporation
thin films
in situ TEM
nanoprecipitates
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spelling Thermal Stability of Cu-Al-Ni Shape Memory Alloy Thin Films Obtained by Nanometer Multilayer DepositionGómez Cortés, José FernandoNó Sánchez, María LuisaChuvilin, AndreyRuiz Larrea, María IsabelSan Juan Núñez, José Maríashape memory alloys (SMA)Cu-Al-Nie-beam evaporationthin filmsin situ TEMnanoprecipitatesCu-Al-Ni is a high-temperature shape memory alloy (HTSMA) with exceptional thermomechanical properties, making it an ideal active material for engineering new technologies able to operate at temperatures up to 200 °C. Recent studies revealed that these alloys exhibit a robust superelastic behavior at the nanometer scale, making them excellent candidates for developing a new generation of micro-/nano-electromechanical systems (MEMS/NEMS). The very large-scale integration (VLSI) technologies used in microelectronics are based on thin films. In the present work, 1 μm thickness thin films of 84.1Cu-12.4 Al-3.5Ni (wt.%) were obtained by solid-state diffusion from a multilayer system deposited on SiNx (200 nm)/Si substrates by e-beam evaporation. With the aim of evaluating the thermal stability of such HTSMA thin films, heating experiments were performed in situ inside the transmission electron microscope to identify the temperature at which the material was decomposed by precipitation. Their microstructure, compositional analysis, and phase identification were characterized by scanning and transmission electron microscopy equipped with energy dispersive X-ray spectrometers. The nucleation and growth of two stable phases, Cu-Al-rich alpha phase and Ni-Al-rich intermetallic, were identified during in situ heating TEM experiments between 280 and 450 °C. These findings show that the used production method produces an HTSMA with high thermal stability and paves the road for developing high-temperature MEMS/NEMS using shape memory and superelastic technologies.This research was funded by the Spanish Ministry of Science and Innovation, project PID2021-122160NB-I00, and the GIU-21/024 from the University of the Basque Country, UPV/EHU. This work made use of the TEM and SEM facilities of the Electron Microscopy and Microanalysis of Materials SGIKER of the UPV/EHU, as well as the FIB facilities of EML at NanoGune.MDPI2023202320232023info:eu-repo/semantics/articleapplication/pdfhttp://hdl.handle.net/10810/62737reponame:Addi. Archivo Digital para la Docencia y la Investigacióninstname:Universidad del País VascoInglésinfo:eu-repo/grantAgreement/MICINN/PID2021-122160NB-I00/https://www.mdpi.com/2079-4991/13/18/2605info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by/4.0/© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).oai:addi.ehu.eus:10810/627372026-06-18T09:23:17Z
dc.title.none.fl_str_mv Thermal Stability of Cu-Al-Ni Shape Memory Alloy Thin Films Obtained by Nanometer Multilayer Deposition
title Thermal Stability of Cu-Al-Ni Shape Memory Alloy Thin Films Obtained by Nanometer Multilayer Deposition
spellingShingle Thermal Stability of Cu-Al-Ni Shape Memory Alloy Thin Films Obtained by Nanometer Multilayer Deposition
Gómez Cortés, José Fernando
shape memory alloys (SMA)
Cu-Al-Ni
e-beam evaporation
thin films
in situ TEM
nanoprecipitates
title_short Thermal Stability of Cu-Al-Ni Shape Memory Alloy Thin Films Obtained by Nanometer Multilayer Deposition
title_full Thermal Stability of Cu-Al-Ni Shape Memory Alloy Thin Films Obtained by Nanometer Multilayer Deposition
title_fullStr Thermal Stability of Cu-Al-Ni Shape Memory Alloy Thin Films Obtained by Nanometer Multilayer Deposition
title_full_unstemmed Thermal Stability of Cu-Al-Ni Shape Memory Alloy Thin Films Obtained by Nanometer Multilayer Deposition
title_sort Thermal Stability of Cu-Al-Ni Shape Memory Alloy Thin Films Obtained by Nanometer Multilayer Deposition
dc.creator.none.fl_str_mv Gómez Cortés, José Fernando
Nó Sánchez, María Luisa
Chuvilin, Andrey
Ruiz Larrea, María Isabel
San Juan Núñez, José María
author Gómez Cortés, José Fernando
author_facet Gómez Cortés, José Fernando
Nó Sánchez, María Luisa
Chuvilin, Andrey
Ruiz Larrea, María Isabel
San Juan Núñez, José María
author_role author
author2 Nó Sánchez, María Luisa
Chuvilin, Andrey
Ruiz Larrea, María Isabel
San Juan Núñez, José María
author2_role author
author
author
author
dc.subject.none.fl_str_mv shape memory alloys (SMA)
Cu-Al-Ni
e-beam evaporation
thin films
in situ TEM
nanoprecipitates
topic shape memory alloys (SMA)
Cu-Al-Ni
e-beam evaporation
thin films
in situ TEM
nanoprecipitates
description Cu-Al-Ni is a high-temperature shape memory alloy (HTSMA) with exceptional thermomechanical properties, making it an ideal active material for engineering new technologies able to operate at temperatures up to 200 °C. Recent studies revealed that these alloys exhibit a robust superelastic behavior at the nanometer scale, making them excellent candidates for developing a new generation of micro-/nano-electromechanical systems (MEMS/NEMS). The very large-scale integration (VLSI) technologies used in microelectronics are based on thin films. In the present work, 1 μm thickness thin films of 84.1Cu-12.4 Al-3.5Ni (wt.%) were obtained by solid-state diffusion from a multilayer system deposited on SiNx (200 nm)/Si substrates by e-beam evaporation. With the aim of evaluating the thermal stability of such HTSMA thin films, heating experiments were performed in situ inside the transmission electron microscope to identify the temperature at which the material was decomposed by precipitation. Their microstructure, compositional analysis, and phase identification were characterized by scanning and transmission electron microscopy equipped with energy dispersive X-ray spectrometers. The nucleation and growth of two stable phases, Cu-Al-rich alpha phase and Ni-Al-rich intermetallic, were identified during in situ heating TEM experiments between 280 and 450 °C. These findings show that the used production method produces an HTSMA with high thermal stability and paves the road for developing high-temperature MEMS/NEMS using shape memory and superelastic technologies.
publishDate 2023
dc.date.none.fl_str_mv 2023
2023
2023
2023
dc.type.none.fl_str_mv info:eu-repo/semantics/article
format article
dc.identifier.none.fl_str_mv http://hdl.handle.net/10810/62737
url http://hdl.handle.net/10810/62737
dc.language.none.fl_str_mv Inglés
language_invalid_str_mv Inglés
dc.relation.none.fl_str_mv info:eu-repo/grantAgreement/MICINN/PID2021-122160NB-I00/
https://www.mdpi.com/2079-4991/13/18/2605
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by/4.0/
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by/4.0/
dc.format.none.fl_str_mv application/pdf
dc.publisher.none.fl_str_mv MDPI
publisher.none.fl_str_mv MDPI
dc.source.none.fl_str_mv reponame:Addi. Archivo Digital para la Docencia y la Investigación
instname:Universidad del País Vasco
instname_str Universidad del País Vasco
reponame_str Addi. Archivo Digital para la Docencia y la Investigación
collection Addi. Archivo Digital para la Docencia y la Investigación
repository.name.fl_str_mv
repository.mail.fl_str_mv
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