Enhancement of thermal boundary conductance of metal-polymer system
In organic electronics, thermal management is a challenge, as most organic materials conduct heat poorly. As these devices become smaller, thermal transport is increasingly limited by organic-inorganic interfaces, for example that between a metal and a polymer. However, the mechanisms of heat transp...
| Autores: | , , , , , , |
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| Tipo de recurso: | artículo |
| Fecha de publicación: | 2020 |
| País: | España |
| Institución: | Universitat Autònoma de Barcelona |
| Repositorio: | Dipòsit Digital de Documents de la UAB |
| Idioma: | inglés |
| OAI Identifier: | oai:ddd.uab.cat:233985 |
| Acceso en línea: | https://ddd.uab.cat/record/233985 https://dx.doi.org/urn:doi:10.3390/nano10040670 |
| Access Level: | acceso abierto |
| Palabra clave: | Adhesion layer Enhancement of thermal boundary conductance Organic electronics Thermal characterization of polymer Thermal conductivity of polymer thin films |
| Sumario: | In organic electronics, thermal management is a challenge, as most organic materials conduct heat poorly. As these devices become smaller, thermal transport is increasingly limited by organic-inorganic interfaces, for example that between a metal and a polymer. However, the mechanisms of heat transport at these interfaces are not well understood. In this work, we compare three types of metal-polymer interfaces. Polymethyl methacrylate (PMMA) films of different thicknesses (1-15 nm) were spin-coated on silicon substrates and covered with an 80 nm gold film either directly, or over an interface layer of 2 nm of an adhesion promoting metal-either titanium or nickel. We use the frequency-domain thermoreflectance (FDTR) technique to measure the effective thermal conductivity of the polymer film and then extract the metal-polymer thermal boundary conductance (TBC) with a thermal resistance circuit model. We found that the titanium layer increased the TBC by a factor of 2, from 59 × 10 W·m·K to 115 × 10 W·m·K, while the nickel layer increased TBC to 139 × 10 W·m·K. These results shed light on possible strategies to improve heat transport in organic electronic systems. |
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