Components, Modules and Systems Integration
Development and production of smart electronic components and systems (ECS) requires physical and functional integration (PFI) of several functionalities into a new physical entity at component, module and system levels (CMS). Therefore, PFI is one of the essential capabilities required to maintain...
| Autores: | , , , , , , |
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| Tipo de recurso: | otro |
| Estado: | Versión publicada |
| Fecha de publicación: | 2024 |
| País: | España |
| Institución: | Consejo Superior de Investigaciones Científicas (CSIC) |
| Repositorio: | DIGITAL.CSIC. Repositorio Institucional del CSIC |
| OAI Identifier: | oai:digital.csic.es:10261/376782 |
| Acceso en línea: | http://hdl.handle.net/10261/376782 |
| Access Level: | acceso abierto |
| Palabra clave: | http://metadata.un.org/sdg/9 Build resilient infrastructure, promote inclusive and sustainable industrialization and foster innovation |
| Sumario: | Development and production of smart electronic components and systems (ECS) requires physical and functional integration (PFI) of several functionalities into a new physical entity at component, module and system levels (CMS). Therefore, PFI is one of the essential capabilities required to maintain and improve the competitiveness of European industry in the application domains of smart systems. Although in practice PFI is often application-specific, the materials, technologies, manufacturing and development processes that form these domains are generic and should be standardized, interoperable and reconfigurable where possible. Heterogeneous integration of devices and components fabricated with separate and different fabrication processes is key to PFI. This chapter deals with approaches beyond the semiconductor technologies, material families and on-chip integrated systems (SoC) covered in Chapter 1.1. In the development of ever better smart systems and innovative products, heterogeneous integration becomes more and more important at every level of integration, from semiconductor SoC to System-in-Package (SiP) and ultimately to larger modules and systems. The importance of SiP technologies in integration terms is emphasized by the treatment of SiP in both this chapter and in Chapter 1.1, from their specific points of view. Particularly, alternative technologies (such as additive manufacturing), complementary materials (both at the functional and structural/substrate level) and heterogeneous approaches to assembly, integration and advanced packaging are considered in this chapter. The term heterogeneous integration is used in its widest meaning: a component should be taken to mean any unit, whether individual chiplet/die, MEMS device, passive or active component or assembled package, that is integrated into higher order single components, modules or systems. Developments of heterogeneous integration technologies and platforms include also flexible electronics and photonics solutions. On the other hand, advanced packaging represents the suite of novel technologies, processes and competences that – in a cost-efficient, environmental sound way – allows for the physical, electrical and functional integration of any set of technological diverse components required to build an advanced system in a way that can safely interact with its application environment. Smart CMS are the key enabling link between basic technologies, e.g. semiconductor or interconnection technology, and key applications as described in the Application Chapters. They open the way for widespread use in all application domains by integrating functionalities such as intelligence, sensing, communication and control, even in the smallest devices, through simultaneous development and co-design with Embedded Software and System of Systems (SoS) technologies and with support from cross-sectional technologies: Artificial Intelligence (AI), Connectivity, Architecture and Design, and Quality, Reliability, Safety and Cybersecurity. The methods, processes and schemes required for the design, production, assembly and testing of the various components, modules and systems and their integration need to be devised with appropriate quality, reliability, repeatability as well as scalability and sustainability (circular economy, CO2 footprint, life cycle considerations, efficient use of resources). Considering the new requirements imposed by modern and future smart systems, mastering the integration technologies at CMS levels is a significant capability of European industries. Such a strength needs to be sustained and reinforced to ensure Europe’s leading position in smart systems engineering, as well as to bring innovations into real-life reliable and sustainable products, services and markets. |
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