Adhesion enhancement of DLC hard coatings by HiPIMS metal ion etching pretreatment
Poor adhesion is a recurrent problem for the wider use of diamond-like carbon (DLC) coatings in industrial applications. In this work, we investigate the effectiveness of high-power impulse magnetron sputtering (HiPIMS) metal ion etching to improve the adhesion of DLC coatings on high speed steel su...
| Autores: | , , , , , , , , , , , , |
|---|---|
| Tipo de recurso: | artículo |
| Fecha de publicación: | 2018 |
| País: | España |
| Institución: | Consejo Superior de Investigaciones Científicas (CSIC) |
| Repositorio: | DIGITAL.CSIC. Repositorio Institucional del CSIC |
| OAI Identifier: | oai:digital.csic.es:10261/181618 |
| Acceso en línea: | http://hdl.handle.net/10261/181618 |
| Access Level: | acceso abierto |
| Palabra clave: | Adhesion HiPIMS Diamond-like carbon (DLC) Hard coatings Interface structure |
| Sumario: | Poor adhesion is a recurrent problem for the wider use of diamond-like carbon (DLC) coatings in industrial applications. In this work, we investigate the effectiveness of high-power impulse magnetron sputtering (HiPIMS) metal ion etching to improve the adhesion of DLC coatings on high speed steel substrates. The influence of HiPIMS pretreatment parameters, the metal ion selection for the process and the addition of bonding layers on the adhesion properties were studied. Daimler-Benz and nanoscratch test methods were used to evaluate the adhesion. The elemental composition, morphology and microstructure of the samples were evaluated by EELS, SEM, AFM and HRTEM. In general, samples pretreated with HiPIMS metal ion etching withstand larger critical loads than those pretreated by conventional Ar+ glow discharge and bonding layers. The pretreatment is proven to be very effective at removing surface contaminants and providing a gradual interface. The selection of Cr over Ti contributes to a significant improvement on the adhesion due to the reduction of the oxygen level at the interface thus ensuring an optimal coating-substrate contact and a more compliant structure, which prevents the delamination failure. |
|---|